Invention Grant
- Patent Title: Flash memory structure with reduced dimension of gate structure
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Application No.: US15694611Application Date: 2017-09-01
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Publication No.: US10304848B2Publication Date: 2019-05-28
- Inventor: Sheng-Chieh Chen , Ming Chyi Liu , Shih-Chang Liu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L29/49 ; H01L29/51 ; H01L21/311 ; H01L23/522 ; H01L23/528 ; H01L23/532 ; H01L29/423 ; H01L21/3213 ; H01L27/11568

Abstract:
An integrated circuit for a flash memory device with enlarged spacing between select and memory gate structures is provided. The enlarged spacing is obtained by forming corner recesses at the select gate structure so that a top surface with a reduced dimension of the select gate structure is obtained. In one example, a semiconductor substrate having memory cell devices formed thereon, the memory cell devices includes a semiconductor substrate having memory cell devices formed thereon, the memory cell devices includes a plurality of select gate structures and a plurality of memory gate structures formed adjacent to the plurality of select gate structures, wherein at least one of the plurality of select gate structures have a corner recess formed below a top surface of the at least one of the plurality of select gate structures.
Public/Granted literature
- US20190074285A1 FLASH MEMORY STRUCTURE WITH REDUCED DIMENSION OF GATE STRUCTURE Public/Granted day:2019-03-07
Information query
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