Invention Grant
- Patent Title: High performance interconnect physical layer
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Application No.: US15918895Application Date: 2018-03-12
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Publication No.: US10380046B2Publication Date: 2019-08-13
- Inventor: Venkatraman Iyer , Darren S. Jue , Robert G. Blankenship , Fulvio Spagna , Ashish Gupta
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alliance IP, LLC
- Main IPC: G06F13/22
- IPC: G06F13/22 ; G06F12/0831 ; G06F13/42 ; G06F8/71 ; G06F8/77 ; G06F9/30 ; G06F12/0806 ; G06F9/46 ; G06F13/40 ; G06F12/0813 ; G06F12/0815 ; G06F9/445 ; G06F11/10 ; H04L9/06 ; G06F1/3287 ; H04L12/933 ; G06F12/0808 ; G06F8/73 ; H04L12/46 ; H04L12/741
Abstract:
Re-initialization of a link can take place without termination of the link, where the link includes, a transmitter and a receiver are to be coupled to each lane in the number of lanes, and re-initialization of the link is to include transmission of a pre-defined sequence on each of the lanes.
Public/Granted literature
- US20180203811A1 HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER Public/Granted day:2018-07-19
Information query
