Invention Grant
- Patent Title: Patterned chuck for substrate processing
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Application No.: US15410634Application Date: 2017-01-19
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Publication No.: US10446430B2Publication Date: 2019-10-15
- Inventor: Terry Bluck , Babak Adibi , Vinay Prabhakar , William Eugene Runstadler, Jr.
- Applicant: Intevac, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: INTEVAC, INC.
- Current Assignee: INTEVAC, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Womble Bond Dickinson (US) LLP
- Agent Joseph Bach, Esq.
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/66 ; H01L21/67 ; H01L21/687
Abstract:
A chuck for wafer processing that counters the deleterious effects of thermal expansion of the wafer. Also, a combination of chuck and shadow mask arrangement that maintains relative alignment between openings in the mask and the wafer in spite of thermal expansion of the wafer. A method for fabricating a solar cell by ion implant, while maintaining relative alignment of the implanted features during thermal expansion of the wafer.
Public/Granted literature
- US20170236740A1 PATTERNED CHUCK FOR SUBSTRATE PROCESSING Public/Granted day:2017-08-17
Information query
IPC分类:
