公开(公告)号：US11255013B2

公开(公告)日：2022-02-22

申请号：US15721638

申请日：2017-09-29

申请人： Intevac, Inc.

发明人： Terry Bluck ,  Babak Adibi

IPC分类号： C23C14/48 ,  C23C14/56 ,  C23C14/08 ,  C23C14/06 ,  C03C17/36 ,  C03C17/245

摘要： The use of non-mass analyzed ion implanter is advantageous in such application as it generates ion implanting at different depth depending on the ions energy and mass. This allows for gaining advantage from lubricity offered as a result of the very light deposition on the surface, and at the same time the hardness provided by the intercalated ions implanted below it, providing benefits for cover glass, low E enhancement, and other similar materials. In further aspects, ion implantation is used to create other desirable film properties such anti-microbial and corrosion resistance.

公开(公告)号：US09583661B2

公开(公告)日：2017-02-28

申请号：US15073427

申请日：2016-03-17

申请人： Intevac, Inc.

发明人： Vinay Prabhakar ,  Babak Adibi

IPC分类号： H01L21/425 ,  C23C16/00 ,  H01L31/05 ,  H01L21/266 ,  H01L31/18 ,  H01L31/068 ,  H01L21/426 ,  H01J37/32

CPC分类号： H01L31/0516 ,  H01J37/32412 ,  H01J37/32422 ,  H01J37/32623 ,  H01J2237/20 ,  H01J2237/3365 ,  H01L21/266 ,  H01L21/426 ,  H01L31/0682 ,  H01L31/1804 ,  H01L31/188 ,  Y02E10/50 ,  Y02E10/547 ,  Y02P70/521

摘要： A grid for minimizing effects of ion divergence in plasma ion implant. The plasma grid is made of a flat plate having a plurality of holes, wherein the holes are arranged in a plurality of rows and a plurality of columns thereby forming beamlets of ions that diverge in one direction. A mask is used to form the implanted shapes on the wafer, wherein the holes in the mask are oriented orthogonally to the direction of beamlet divergence.

摘要翻译： 用于最小化离子发散在等离子体离子注入中的网格。 等离子体格栅由具有多个孔的平板制成，其中孔布置成多行和多个列，从而形成沿一个方向发散的离子束。 掩模用于在晶片上形成植入的形状，其中掩模中的孔与子束发散的方向垂直。

公开(公告)号：US09543114B2

公开(公告)日：2017-01-10

申请号：US14819402

申请日：2015-08-05

申请人： Intevac, Inc.

发明人： Babak Adibi ,  Vinay Prabhakar ,  Terry Bluck

IPC分类号： G01N23/00 ,  H01J37/20 ,  H01J37/18 ,  H01J37/317

CPC分类号： H01J37/20 ,  H01J37/185 ,  H01J37/3045 ,  H01J37/3171 ,  H01J2237/2007 ,  H01J2237/202 ,  H01J2237/204 ,  H01J2237/31701 ,  H01J2237/31711

摘要： System and method to align a substrate under a shadow mask. A substrate holder has alignment mechanism, such as rollers, that is made to abut against an alignment straight edge. The substrate is then aligned with respect to the straight edge and is chucked to the substrate holder. The substrate holder is then transported into a vacuum processing chamber, wherein it is made to abut against a mask straight edge to which the shadow mask is attached and aligned to. Since the substrate was aligned to an alignment straight edge, and since the mask is aligned to the mask straight edge that is precisely aligned to the alignment straight edge, the substrate is perfectly aligned to the mask.

摘要翻译： 将底物对准荫罩的系统和方法。 衬底保持器具有对准机构，例如辊，其抵靠对准直边缘。 然后将衬底相对于直边对准，并被夹持到衬底保持器。 然后将衬底保持器输送到真空处理室中，其中它与邻接荫罩直线边缘抵接，荫罩直线边缘与阴罩对准。 由于衬底与对准直边对准，并且由于掩模与精确地对准直线对准的掩模直边对准，所以基板与掩模完全对准。

公开(公告)号：US20160204295A1

公开(公告)日：2016-07-14

申请号：US15073427

申请日：2016-03-17

申请人： Intevac, Inc.

发明人： Vinay Prabhakar ,  Babak Adibi

IPC分类号： H01L31/05 ,  H01J37/32 ,  H01L31/18

CPC分类号： H01L31/0516 ,  H01J37/32412 ,  H01J37/32422 ,  H01J37/32623 ,  H01J2237/20 ,  H01J2237/3365 ,  H01L21/266 ,  H01L21/426 ,  H01L31/0682 ,  H01L31/1804 ,  H01L31/188 ,  Y02E10/50 ,  Y02E10/547 ,  Y02P70/521

摘要： A grid for minimizing effects of ion divergence in plasma ion implant. The plasma grid is made of a flat plate having a plurality of holes, wherein the holes are arranged in a plurality of rows and a plurality of columns thereby forming beamlets of ions that diverge in one direction. A mask is used to form the implanted shapes on the wafer, wherein the holes in the mask are oriented orthogonally to the direction of beamlet divergence.

摘要翻译： 用于最小化离子发散在等离子体离子注入中的网格。 等离子体格栅由具有多个孔的平板制成，其中孔布置成多行和多个列，从而形成沿一个方向发散的离子束。 掩模用于在晶片上形成植入的形状，其中掩模中的孔与子束发散的方向垂直。

公开(公告)号：US20160181465A1

公开(公告)日：2016-06-23

申请号：US15054049

申请日：2016-02-25

申请人： Intevac, Inc.

发明人： Babak Adibi ,  Moon Chun

IPC分类号： H01L31/18 ,  H01J37/32 ,  H01L31/068

CPC分类号： H01L31/1876 ,  C23C14/042 ,  C23C14/48 ,  H01J37/185 ,  H01J37/3171 ,  H01J37/32412 ,  H01J37/32422 ,  H01J2237/0437 ,  H01J2237/184 ,  H01J2237/201 ,  H01J2237/327 ,  H01J2237/3365 ,  H01L21/2236 ,  H01L31/068 ,  H01L31/0682 ,  H01L31/1804 ,  H01L31/1864 ,  Y02E10/547 ,  Y02P70/521

摘要： An ion implantation system having a grid assembly. The system includes a plasma source configured to provide plasma in a plasma region; a first grid plate having a plurality of apertures configured to allow ions from the plasma region to pass therethrough, wherein the first grid plate is configured to be biased by a power supply; a second grid plate having a plurality of apertures configured to allow the ions to pass therethrough subsequent to the ions passing through the first grid plate, wherein the second grid plate is configured to be biased by a power supply; and a substrate holder configured to support a substrate in a position where the substrate is implanted with the ions subsequent to the ions passing through the second grid plate.

公开(公告)号：US09303314B2

公开(公告)日：2016-04-05

申请号：US14510109

申请日：2014-10-08

申请人： Intevac, Inc.

发明人： Babak Adibi ,  Moon Chun

IPC分类号： H01L31/18 ,  C23C14/48 ,  C23C14/04 ,  H01J37/32 ,  H01L21/223 ,  H01J37/18 ,  H01J37/317 ,  H01L31/068

CPC分类号： H01L31/1876 ,  C23C14/042 ,  C23C14/48 ,  H01J37/185 ,  H01J37/3171 ,  H01J37/32412 ,  H01J37/32422 ,  H01J2237/0437 ,  H01J2237/184 ,  H01J2237/201 ,  H01J2237/327 ,  H01J2237/3365 ,  H01L21/2236 ,  H01L31/068 ,  H01L31/0682 ,  H01L31/1804 ,  H01L31/1864 ,  Y02E10/547 ,  Y02P70/521

摘要： An ion implantation system having a grid assembly. The system includes a plasma source configured to provide plasma in a plasma region; a first grid plate having a plurality of apertures configured to allow ions from the plasma region to pass therethrough, wherein the first grid plate is configured to be biased by a power supply; a second grid plate having a plurality of apertures configured to allow the ions to pass therethrough subsequent to the ions passing through the first grid plate, wherein the second grid plate is configured to be biased by a power supply; and a substrate holder configured to support a substrate in a position where the substrate is implanted with the ions subsequent to the ions passing through the second grid plate.

公开(公告)号：US20160042913A1

公开(公告)日：2016-02-11

申请号：US14819402

申请日：2015-08-05

申请人： Intevac, Inc.

发明人： Babak Adibi ,  Vinay Prabhakar ,  Terry Bluck

IPC分类号： H01J37/20 ,  H01J37/18 ,  H01J37/317

CPC分类号： H01J37/20 ,  H01J37/185 ,  H01J37/3045 ,  H01J37/3171 ,  H01J2237/2007 ,  H01J2237/202 ,  H01J2237/204 ,  H01J2237/31701 ,  H01J2237/31711

摘要： System and method to align a substrate under a shadow mask. A substrate holder has alignment mechanism, such as rollers, that is made to abut against an alignment straight edge. The substrate is then aligned with respect to the straight edge and is chucked to the substrate holder. The substrate holder is then transported into a vacuum processing chamber, wherein it is made to abut against a mask straight edge to which the shadow mask is attached and aligned to. Since the substrate was aligned to an alignment straight edge, and since the mask is aligned to the mask straight edge that is precisely aligned to the alignment straight edge, the substrate is perfectly aligned to the mask.

摘要翻译： 将底物对准荫罩的系统和方法。 衬底保持器具有对准机构，例如辊，其抵靠对准直边缘。 然后将衬底相对于直边对准，并被夹持到衬底保持器。 然后将衬底保持器输送到真空处理室中，其中它与邻接荫罩直线边缘抵接，荫罩直线边缘与阴罩对准。 由于衬底与对准直边对准，并且由于掩模与精确地对准直线对准的掩模直边对准，所以基板与掩模完全对准。

公开(公告)号：US10854772B2

公开(公告)日：2020-12-01

申请号：US16040387

申请日：2018-07-19

申请人： Intevac, Inc.

发明人： Hoang Huy Vu ,  Babak Adibi ,  Terry Bluck

IPC分类号： H01L31/18 ,  H01J37/317 ,  H01L31/0203 ,  H01J37/20

摘要： A system for transporting substrates and precisely align the substrates horizontally and vertically. The system decouples the functions of transporting the substrates, vertically aligning the substrates, and horizontally aligning the substrates. The transport system includes a carriage upon which plurality of chuck assemblies are loosely positioned, each of the chuck assemblies includes a base having vertical alignment wheels to place the substrate in precise vertical alignment. A pedestal is configured to freely slide on the base. The pedestal includes a set of horizontal alignment wheels that precisely align the pedestal in the horizontal direction. An electrostatic chuck is magnetically held to the pedestal.

公开(公告)号：US20180023190A1

公开(公告)日：2018-01-25

申请号：US15721638

申请日：2017-09-29

申请人： Intevac, Inc.

发明人： Terry Bluck ,  Babak Adibi

IPC分类号： C23C14/48 ,  C23C14/56 ,  C23C14/08 ,  C23C14/06 ,  C03C17/245

CPC分类号： C23C14/48 ,  C03C17/245 ,  C03C17/36 ,  C03C17/3626 ,  C03C17/3644 ,  C03C17/366 ,  C23C14/0652 ,  C23C14/083 ,  C23C14/568

摘要： The use of non-mass analyzed ion implanter is advantageous in such application as it generates ion implanting at different depth depending on the ions energy and mass. This allows for gaining advantage from lubricity offered as a result of the very light deposition on the surface, and at the same time the hardness provided by the intercalated ions implanted below it, providing benefits for cover glass, low E enhancement, and other similar materials. In further aspects, ion implantation is used to create other desirable film properties such anti-microbial and corrosion resistance.

公开(公告)号：US09875922B2

公开(公告)日：2018-01-23

申请号：US15099523

申请日：2016-04-14

申请人： Intevac, Inc.

发明人： Terry Pederson ,  Henry Hieslmair ,  Moon Chun ,  Vinay Prabhakar ,  Babak Adibi ,  Terry Bluck

IPC分类号： H01L21/683 ,  H01L21/677 ,  H01L21/265 ,  H01L21/68 ,  H01L31/18 ,  H02N13/00

CPC分类号： H01L21/6833 ,  H01L21/26506 ,  H01L21/67745 ,  H01L21/6776 ,  H01L21/681 ,  H01L21/6831 ,  H01L31/1876 ,  H02N13/00 ,  Y02E10/50 ,  Y02P70/521

摘要： A system for processing substrates has a vacuum enclosure and a processing chamber situated to process wafers in a processing zone inside the vacuum enclosure. Two rail assemblies are provided, one on each side of the processing zone. Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head has plurality of electrostatic chucks that pick up the wafers from the front side of the wafers. Cooling channels in the processing chucks are used to create air cushion to assist in aligning the wafers when delivered by the pickup head.