公开(公告)号：US09875922B2

公开(公告)日：2018-01-23

申请号：US15099523

申请日：2016-04-14

Applicant: Intevac, Inc.

Inventor： Terry Pederson ,  Henry Hieslmair ,  Moon Chun ,  Vinay Prabhakar ,  Babak Adibi ,  Terry Bluck

IPC: H01L21/683 ,  H01L21/677 ,  H01L21/265 ,  H01L21/68 ,  H01L31/18 ,  H02N13/00

CPC classification number: H01L21/6833 ,  H01L21/26506 ,  H01L21/67745 ,  H01L21/6776 ,  H01L21/681 ,  H01L21/6831 ,  H01L31/1876 ,  H02N13/00 ,  Y02E10/50 ,  Y02P70/521

Abstract: A system for processing substrates has a vacuum enclosure and a processing chamber situated to process wafers in a processing zone inside the vacuum enclosure. Two rail assemblies are provided, one on each side of the processing zone. Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head has plurality of electrostatic chucks that pick up the wafers from the front side of the wafers. Cooling channels in the processing chucks are used to create air cushion to assist in aligning the wafers when delivered by the pickup head.

公开(公告)号：US20170236740A1

公开(公告)日：2017-08-17

申请号：US15410634

申请日：2017-01-19

Applicant: Intevac, Inc.

Inventor： Terry Bluck ,  Babak Adibi ,  Vinay Prabhakar ,  William Eugene Runstadler, JR.

IPC: H01L21/683 ,  H01L21/66

CPC classification number: H01L21/6833 ,  H01L21/67288 ,  H01L21/6831 ,  H01L21/68735 ,  H01L21/6875 ,  H01L22/12

Abstract: A chuck for wafer processing that counters the deleterious effects of thermal expansion of the wafer. Also, a combination of chuck and shadow mask arrangement that maintains relative alignment between openings in the mask and the wafer in spite of thermal expansion of the wafer. A method for fabricating a solar cell by ion implant, while maintaining relative alignment of the implanted features during thermal expansion of the wafer.

公开(公告)号：US09583661B2

公开(公告)日：2017-02-28

申请号：US15073427

申请日：2016-03-17

Applicant: Intevac, Inc.

Inventor： Vinay Prabhakar ,  Babak Adibi

IPC: H01L21/425 ,  C23C16/00 ,  H01L31/05 ,  H01L21/266 ,  H01L31/18 ,  H01L31/068 ,  H01L21/426 ,  H01J37/32

CPC classification number: H01L31/0516 ,  H01J37/32412 ,  H01J37/32422 ,  H01J37/32623 ,  H01J2237/20 ,  H01J2237/3365 ,  H01L21/266 ,  H01L21/426 ,  H01L31/0682 ,  H01L31/1804 ,  H01L31/188 ,  Y02E10/50 ,  Y02E10/547 ,  Y02P70/521

Abstract: A grid for minimizing effects of ion divergence in plasma ion implant. The plasma grid is made of a flat plate having a plurality of holes, wherein the holes are arranged in a plurality of rows and a plurality of columns thereby forming beamlets of ions that diverge in one direction. A mask is used to form the implanted shapes on the wafer, wherein the holes in the mask are oriented orthogonally to the direction of beamlet divergence.

Abstract translation: 用于最小化离子发散在等离子体离子注入中的网格。 等离子体格栅由具有多个孔的平板制成，其中孔布置成多行和多个列，从而形成沿一个方向发散的离子束。 掩模用于在晶片上形成植入的形状，其中掩模中的孔与子束发散的方向垂直。

公开(公告)号：US09543114B2

公开(公告)日：2017-01-10

申请号：US14819402

申请日：2015-08-05

Applicant: Intevac, Inc.

Inventor： Babak Adibi ,  Vinay Prabhakar ,  Terry Bluck

IPC: G01N23/00 ,  H01J37/20 ,  H01J37/18 ,  H01J37/317

CPC classification number: H01J37/20 ,  H01J37/185 ,  H01J37/3045 ,  H01J37/3171 ,  H01J2237/2007 ,  H01J2237/202 ,  H01J2237/204 ,  H01J2237/31701 ,  H01J2237/31711

Abstract: System and method to align a substrate under a shadow mask. A substrate holder has alignment mechanism, such as rollers, that is made to abut against an alignment straight edge. The substrate is then aligned with respect to the straight edge and is chucked to the substrate holder. The substrate holder is then transported into a vacuum processing chamber, wherein it is made to abut against a mask straight edge to which the shadow mask is attached and aligned to. Since the substrate was aligned to an alignment straight edge, and since the mask is aligned to the mask straight edge that is precisely aligned to the alignment straight edge, the substrate is perfectly aligned to the mask.

Abstract translation: 将底物对准荫罩的系统和方法。 衬底保持器具有对准机构，例如辊，其抵靠对准直边缘。 然后将衬底相对于直边对准，并被夹持到衬底保持器。 然后将衬底保持器输送到真空处理室中，其中它与邻接荫罩直线边缘抵接，荫罩直线边缘与阴罩对准。 由于衬底与对准直边对准，并且由于掩模与精确地对准直线对准的掩模直边对准，所以基板与掩模完全对准。

公开(公告)号：US20160204295A1

公开(公告)日：2016-07-14

申请号：US15073427

申请日：2016-03-17

Applicant: Intevac, Inc.

Inventor： Vinay Prabhakar ,  Babak Adibi

IPC: H01L31/05 ,  H01J37/32 ,  H01L31/18

CPC classification number: H01L31/0516 ,  H01J37/32412 ,  H01J37/32422 ,  H01J37/32623 ,  H01J2237/20 ,  H01J2237/3365 ,  H01L21/266 ,  H01L21/426 ,  H01L31/0682 ,  H01L31/1804 ,  H01L31/188 ,  Y02E10/50 ,  Y02E10/547 ,  Y02P70/521

Abstract: A grid for minimizing effects of ion divergence in plasma ion implant. The plasma grid is made of a flat plate having a plurality of holes, wherein the holes are arranged in a plurality of rows and a plurality of columns thereby forming beamlets of ions that diverge in one direction. A mask is used to form the implanted shapes on the wafer, wherein the holes in the mask are oriented orthogonally to the direction of beamlet divergence.

Abstract translation: 用于最小化离子发散在等离子体离子注入中的网格。 等离子体格栅由具有多个孔的平板制成，其中孔布置成多行和多个列，从而形成沿一个方向发散的离子束。 掩模用于在晶片上形成植入的形状，其中掩模中的孔与子束发散的方向垂直。

公开(公告)号：US20160042913A1

公开(公告)日：2016-02-11

申请号：US14819402

申请日：2015-08-05

Applicant: Intevac, Inc.

Inventor： Babak Adibi ,  Vinay Prabhakar ,  Terry Bluck

IPC: H01J37/20 ,  H01J37/18 ,  H01J37/317

CPC classification number: H01J37/20 ,  H01J37/185 ,  H01J37/3045 ,  H01J37/3171 ,  H01J2237/2007 ,  H01J2237/202 ,  H01J2237/204 ,  H01J2237/31701 ,  H01J2237/31711

Abstract: System and method to align a substrate under a shadow mask. A substrate holder has alignment mechanism, such as rollers, that is made to abut against an alignment straight edge. The substrate is then aligned with respect to the straight edge and is chucked to the substrate holder. The substrate holder is then transported into a vacuum processing chamber, wherein it is made to abut against a mask straight edge to which the shadow mask is attached and aligned to. Since the substrate was aligned to an alignment straight edge, and since the mask is aligned to the mask straight edge that is precisely aligned to the alignment straight edge, the substrate is perfectly aligned to the mask.

Abstract translation: 将底物对准荫罩的系统和方法。 衬底保持器具有对准机构，例如辊，其抵靠对准直边缘。 然后将衬底相对于直边对准，并被夹持到衬底保持器。 然后将衬底保持器输送到真空处理室中，其中它与邻接荫罩直线边缘抵接，荫罩直线边缘与阴罩对准。 由于衬底与对准直边对准，并且由于掩模与精确地对准直线对准的掩模直边对准，所以基板与掩模完全对准。

公开(公告)号：US20160233122A1

公开(公告)日：2016-08-11

申请号：US15099523

申请日：2016-04-14

Applicant: Intevac, Inc.

Inventor： Terry Pederson ,  Henry Hieslmair ,  Moon Chun ,  Vinay Prabhakar ,  Babak Adibi ,  Terry Bluck

IPC: H01L21/683 ,  H02N13/00

CPC classification number: H01L21/6833 ,  H01L21/26506 ,  H01L21/67745 ,  H01L21/6776 ,  H01L21/681 ,  H01L21/6831 ,  H01L31/1876 ,  H02N13/00 ,  Y02E10/50 ,  Y02P70/521

Abstract: A system for processing substrates has a vacuum enclosure and a processing chamber situated to process wafers in a processing zone inside the vacuum enclosure. Two rail assemblies are provided, one on each side of the processing zone. Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head has plurality of electrostatic chucks that pick up the wafers from the front side of the wafers. Cooling channels in the processing chucks are used to create air cushion to assist in aligning the wafers when delivered by the pickup head.

公开(公告)号：US09324598B2

公开(公告)日：2016-04-26

申请号：US13672652

申请日：2012-11-08

Applicant: INTEVAC, INC.

Inventor： Terry Pederson ,  Henry Hieslmair ,  Moon Chun ,  Vinay Prabhakar ,  Babak Adibi ,  Terry Bluck

IPC: H01L21/677 ,  H01L21/265 ,  H01L21/68 ,  H01L31/18 ,  H01L21/683

CPC classification number: H01L21/6833 ,  H01L21/26506 ,  H01L21/67745 ,  H01L21/6776 ,  H01L21/681 ,  H01L21/6831 ,  H01L31/1876 ,  H02N13/00 ,  Y02E10/50 ,  Y02P70/521

Abstract: A system for processing substrates has a vacuum enclosure and a processing chamber situated to process wafers in a processing zone inside the vacuum enclosure. Two rail assemblies are provided, one on each side of the processing zone. Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head has plurality of electrostatic chucks that pick up the wafers from the front side of the wafers. Cooling channels in the processing chucks are used to create air cushion to assist in aligning the wafers when delivered by the pickup head.

Abstract translation: 用于处理衬底的系统具有真空外壳和位于处理真空外壳内的处理区中的晶片的处理室。 提供两个轨道组件，一个在处理区域的每一侧。 两个卡盘阵列，每个在一个导轨组件上，使得每个卡盘阵列悬挂在一个导轨组件上并支撑多个卡盘。 轨道组件联接到升降机构，其将轨道放置在用于处理的上部位置，并且在较低位置处返回用于装载新晶片的卡盘组件。 拾取头组件将晶片从传送器装载到卡盘组件上。 拾取头具有从晶片的前侧拾取晶片的多个静电卡盘。 处理卡盘中的冷却通道用于产生气垫，以在由拾取头传送时帮助对准晶片。

公开(公告)号：US09318332B2

公开(公告)日：2016-04-19

申请号：US14135519

申请日：2013-12-19

Applicant: Intevac, Inc.

Inventor： Vinay Prabhakar ,  Babak Adibi

IPC: H01L21/425 ,  C23C16/00 ,  H01L21/266 ,  H01L31/068 ,  H01L31/18 ,  H01L21/426 ,  H01J37/32

CPC classification number: H01L31/0516 ,  H01J37/32412 ,  H01J37/32422 ,  H01J37/32623 ,  H01J2237/20 ,  H01J2237/3365 ,  H01L21/266 ,  H01L21/426 ,  H01L31/0682 ,  H01L31/1804 ,  H01L31/188 ,  Y02E10/50 ,  Y02E10/547 ,  Y02P70/521

Abstract: A grid for minimizing effects of ion divergence in plasma ion implant. The plasma grid is made of a flat plate having a plurality of holes, wherein the holes are arranged in a plurality of rows and a plurality of columns thereby forming beamlets of ions that diverge in one direction. A mask is used to form the implanted shapes on the wafer, wherein the holes in the mask are oriented orthogonally to the direction of beamlet divergence.

Abstract translation: 用于最小化离子发散在等离子体离子注入中的网格。 等离子体格栅由具有多个孔的平板制成，其中孔布置成多行和多个列，从而形成沿一个方向发散的离子束。 掩模用于在晶片上形成植入的形状，其中掩模中的孔与子束发散的方向垂直。

公开(公告)号：US10446430B2

公开(公告)日：2019-10-15

申请号：US15410634

申请日：2017-01-19

Applicant: Intevac, Inc.

Inventor： Terry Bluck ,  Babak Adibi ,  Vinay Prabhakar ,  William Eugene Runstadler, Jr.

IPC: H01L21/683 ,  H01L21/66 ,  H01L21/67 ,  H01L21/687

Abstract: A chuck for wafer processing that counters the deleterious effects of thermal expansion of the wafer. Also, a combination of chuck and shadow mask arrangement that maintains relative alignment between openings in the mask and the wafer in spite of thermal expansion of the wafer. A method for fabricating a solar cell by ion implant, while maintaining relative alignment of the implanted features during thermal expansion of the wafer.