Invention Grant
- Patent Title: Porous chemical mechanical polishing pads
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Application No.: US15394044Application Date: 2016-12-29
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Publication No.: US10456886B2Publication Date: 2019-10-29
- Inventor: Sivapackia Ganapathiappan , Nag B. Patibandla , Rajeev Bajaj , Daniel Redfield , Fred C. Redeker , Mahendra C. Orilall , Boyi Fu , Mayu Yamamura , Ashwin Chockalingam
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: B24D3/20
- IPC: B24D3/20 ; B24D3/28 ; B24D11/02 ; B24B37/22 ; B24B37/24 ; B24B37/26 ; B33Y10/00 ; B33Y80/00

Abstract:
Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.
Public/Granted literature
- US20170203406A1 POROUS CHEMICAL MECHANICAL POLISHING PADS Public/Granted day:2017-07-20
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