Invention Grant
- Patent Title: Polishing method
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Application No.: US15760619Application Date: 2016-09-21
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Publication No.: US10478939B2Publication Date: 2019-11-19
- Inventor: Yukinobu Yoshizaki , Satoru Yarita , Shogo Onishi
- Applicant: FUJIMI INCORPORATED
- Applicant Address: JP
- Assignee: FUJIMI INCORPORATED
- Current Assignee: FUJIMI INCORPORATED
- Current Assignee Address: JP
- Agency: Katten Muchin Rosenman LLP
- Priority: JP2015-192422 20150930
- International Application: PCT/JP2016/077906 WO 20160921
- International Announcement: WO2017/057156 WO 20170406
- Main IPC: B24B37/04
- IPC: B24B37/04 ; B24B37/00 ; C09G1/02 ; C09K3/14 ; H01L21/306 ; H01L21/3105 ; H01L21/321
Abstract:
The present invention provides a means allowing achievement of sufficient planarization of the surface of an object to be polished containing two or more types of materials.The present invention is a polishing method for polishing an object to be polished containing two or more types of materials by using a polishing composition, the polishing method including equalization of the surface zeta potential of the object to be polished.
Public/Granted literature
- US20180257194A1 POLISHING METHOD Public/Granted day:2018-09-13
Information query
