Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US15467001Application Date: 2017-03-23
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Publication No.: US10593571B2Publication Date: 2020-03-17
- Inventor: Hiroaki Inadomi , Tooru Nakamura , Kouji Kimoto , Yasuo Kiyohara , Satoshi Okamura , Satoshi Biwa , Nobuya Yamamoto , Katsuhiro Ookawa , Keiichi Yahata , Tetsuro Nakahara
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2016-070517 20160331
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B08B3/02 ; B08B3/08 ; B08B3/10

Abstract:
Provided is a substrate processing apparatus including a liquid processing unit that performs a liquid processing on a substrate; a drying processing unit that performs a drying processing on the substrate in a wet state; a first conveyance unit that conveys the substrate to the liquid processing unit; a second conveyance unit that conveys the substrate in the wet state from the liquid processing unit to the drying processing unit; and a third conveyance unit that conveys the substrate before the liquid processing in the liquid processing unit and to convey the substrate after the drying processing from the drying processing unit. The first and second conveyance units and the drying processing unit are disposed on a side that faces the third conveyance unit, and the liquid processing unit is disposed on a side that faces the first and second conveyance units and is opposite to the third conveyance unit.
Public/Granted literature
- US20170287742A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2017-10-05
Information query
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