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公开(公告)号:US12057327B2
公开(公告)日:2024-08-06
申请号:US18107935
申请日:2023-02-09
Applicant: TOKYO ELECTRON LIMITED
Inventor: Masataka Gosho , Yuichi Douki , Satoshi Biwa , Satoshi Okamura , Katsuhiro Ookawa , Yuichiro Kunugimoto
CPC classification number: H01L21/67051 , B08B3/08 , B08B7/04 , H01L21/02057 , H01L21/02101 , H01L21/67028 , H01L21/67253 , H01L21/67288 , H01L21/68764 , H01L22/12 , H01L22/20 , H01L21/67248
Abstract: There is provided a substrate processing apparatus comprising a liquid amount detecting part configured to detect a liquid amount of a liquid film formed on a substrate; and a coating state detecting part configured to detect a coating state of the substrate with the liquid film formed thereon.
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公开(公告)号:US20180254180A1
公开(公告)日:2018-09-06
申请号:US15908967
申请日:2018-03-01
Applicant: Tokyo Electron Limited
Inventor: Gentaro Goshi , Keisuke Egashira , Kento Tsukano , Hiroshi Marumoto , Takuro Masuzumi , Katsuhiro Ookawa , Hiromi Kiyose
CPC classification number: H01L21/02043 , B08B3/10 , H01L21/02057 , H01L21/0206 , H01L21/02101 , H01L21/67028 , H01L21/67051 , H01L21/6715 , H01L21/67253 , H01L22/12 , H01L22/20
Abstract: A substrate processing apparatus of an exemplary embodiment includes a liquid processing unit, a detection unit, and a post-processing unit. The liquid processing unit supplies a liquid to a substrate to form a liquid film on the substrate. The detection unit detects the amount of a liquid on the substrate to determine whether the amount of the liquid is acceptable or not. The post-processing unit processes the substrate having the liquid film formed thereon.
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公开(公告)号:US10593571B2
公开(公告)日:2020-03-17
申请号:US15467001
申请日:2017-03-23
Applicant: Tokyo Electron Limited
Inventor: Hiroaki Inadomi , Tooru Nakamura , Kouji Kimoto , Yasuo Kiyohara , Satoshi Okamura , Satoshi Biwa , Nobuya Yamamoto , Katsuhiro Ookawa , Keiichi Yahata , Tetsuro Nakahara
Abstract: Provided is a substrate processing apparatus including a liquid processing unit that performs a liquid processing on a substrate; a drying processing unit that performs a drying processing on the substrate in a wet state; a first conveyance unit that conveys the substrate to the liquid processing unit; a second conveyance unit that conveys the substrate in the wet state from the liquid processing unit to the drying processing unit; and a third conveyance unit that conveys the substrate before the liquid processing in the liquid processing unit and to convey the substrate after the drying processing from the drying processing unit. The first and second conveyance units and the drying processing unit are disposed on a side that faces the third conveyance unit, and the liquid processing unit is disposed on a side that faces the first and second conveyance units and is opposite to the third conveyance unit.
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公开(公告)号:US20170287742A1
公开(公告)日:2017-10-05
申请号:US15467001
申请日:2017-03-23
Applicant: Tokyo Electron Limited
Inventor: Hiroaki Inadomi , Tooru Nakamura , Kouji Kimoto , Yasuo Kiyohara , Satoshi Okamura , Satoshi Biwa , Nobuya Yamamoto , Katsuhiro Ookawa , Keiichi Yahata , Tetsuro Nakahara
Abstract: Provided is a substrate processing apparatus including a liquid processing unit that performs a liquid processing on a substrate; a drying processing unit that performs a drying processing on the substrate in a wet state; a first conveyance unit that conveys the substrate to the liquid processing unit; a second conveyance unit that conveys the substrate in the wet state from the liquid processing unit to the drying processing unit; and a third conveyance unit that conveys the substrate before the liquid processing in the liquid processing unit and to convey the substrate after the drying processing from the drying processing unit. The first and second conveyance units and the drying processing unit are disposed on a side that faces the third conveyance unit, and the liquid processing unit is disposed on a side that faces the first and second conveyance units and is opposite to the third conveyance unit.
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