Invention Grant
- Patent Title: Engineered polymer-based electronic materials
-
Application No.: US15562195Application Date: 2016-03-31
-
Publication No.: US10682732B2Publication Date: 2020-06-16
- Inventor: Ramakrishna Hosur Venkatagiriyappa , Morgana De Avila Ribas , Barun Das , Harish Hanchina Siddappa , Sutapa Mukherjee , Siuli Sarkar , Bawa Singh , Rahul Raut , Ranjit Pandher
- Applicant: Alpha Assembly Solutions Inc.
- Applicant Address: US NJ Somerset
- Assignee: ALPHA ASSEMBLY SOLUTIONS INC.
- Current Assignee: ALPHA ASSEMBLY SOLUTIONS INC.
- Current Assignee Address: US NJ Somerset
- Agency: Carmody Torrance Sandak & Hennessey LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@44c3f4b3
- International Application: PCT/GB2016/050910 WO 20160331
- International Announcement: WO2016/156853 WO 20161006
- Main IPC: C09J163/00
- IPC: C09J163/00 ; C08L63/00 ; C08K3/00 ; C08K3/04 ; C08K3/34 ; C08K5/54 ; C08K9/00 ; B23K35/36 ; B23K1/00 ; B23K35/02 ; H01L23/29 ; H01L23/00 ; C08K5/00 ; C08K3/013 ; B23K1/20 ; C08K7/02 ; B23K35/00 ; C08K5/549 ; B32B27/38 ; B23K101/42
Abstract:
A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.
Public/Granted literature
- US20190143461A9 Engineered Polymer-Based Electronic Materials Public/Granted day:2019-05-16
Information query
