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公开(公告)号：US10322471B2
公开(公告)日：2019-06-18
申请号：US15326180
申请日：2015-07-15
发明人： Pritha Choudhury , Morgana De Avila Ribas , Sutapa Mukherjee , Siuli Sarkar , Ranjit Pandher , Ravindra Bhatkal , Bawa Singh
IPC分类号： B23K31/02 , B23K35/26 , B23K35/00 , C22C13/00 , C22C13/02 , B23K1/00 , B23K1/002 , B23K1/005 , B23K1/08 , B23K35/02 , H01L23/00 , B23K101/40 , B23K101/42
摘要： A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.
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公开(公告)号：US09786629B2
公开(公告)日：2017-10-10
申请号：US14908986
申请日：2014-07-31
发明人： Ramakrishna Hosur Venkatagiriyappa , Sutapa Mukherjee , Harish Hanchina Siddappa , Morgana De Avila Ribas , Siuli Sarkar , Bawa Singh , Rahul Raut
CPC分类号： H01L24/81 , H01L21/563 , H01L22/12 , H01L23/293 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/92 , H01L2224/13101 , H01L2224/13111 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/81026 , H01L2224/81192 , H01L2224/81815 , H01L2224/81908 , H01L2224/83855 , H01L2224/92125 , H01L2924/0133 , H05K3/284 , H05K3/3436 , H05K3/3489 , H05K2201/10734 , H05K2201/10977 , H01L2924/014 , H01L2924/00014 , H01L2924/0665 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/00
摘要： Dual-side reinforcement (DSR) materials and methods for semiconductor fabrication. The DSR materials exhibit the properties of conventional underfill materials with enhanced stability at room temperature.
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公开(公告)号：US20230330788A1
公开(公告)日：2023-10-19
申请号：US18205590
申请日：2023-06-05
发明人： Pritha Choudhury , Morgana De Avila Ribas , Sutapa Mukherjee , Anil Kumar , Siuli Sarkar , Ranjit Pandher , Ravi Bhatkal , Bawa Singh
IPC分类号： B23K35/02 , B23K1/012 , B23K1/005 , B23K35/26 , B23K1/08 , B23K1/00 , H05K3/34 , C22C13/02 , B23K1/20 , B23K1/002 , B23K1/19 , C22C13/00
CPC分类号： B23K35/262 , B23K1/00 , B23K1/0016 , B23K1/002 , B23K1/0056 , B23K1/012 , B23K1/085 , B23K1/19 , B23K1/203 , B23K35/0222 , B23K35/0227 , B23K35/0233 , B23K35/0244 , B23K35/025 , C22C13/00 , C22C13/02 , H05K3/3457 , H05K3/3463 , B23K2103/12 , Y10T403/479
摘要： A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt.% of silver, 2.5 to 4 wt.% of bismuth, 0.3 to 0.8 wt.% of copper, 0.03 to 1 wt.% nickel, 0.005 to 1 wt.% germanium, and a balance of tin, together with any unavoidable impurities.
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公开(公告)号：US20210205935A1
公开(公告)日：2021-07-08
申请号：US17149503
申请日：2021-01-14
发明人： Shamik Ghoshal , Remya Chandran , Sutapa Mukherjee , Siuli Sarkar , Ranjit Pandher , Bawa Singh
摘要： A sintering powder, wherein a least a portion of the particles making up the sintering powder comprise: a core comprising a first material; and a shell at least partially coating the core, the shell comprising a second material having a lower oxidation potential than the first material.
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公开(公告)号：US20170197281A1
公开(公告)日：2017-07-13
申请号：US15326180
申请日：2015-07-15
发明人： Pritha Choudhury , Morgana De Avila Ribas , Sutapa Mukherjee , Siuli Sarkar , Ranjit Pandher , Ravindra Bhatkal , Bawa Singh
CPC分类号： B23K35/262 , B23K1/0016 , B23K1/002 , B23K1/0056 , B23K1/085 , B23K35/00 , B23K35/0222 , B23K35/0227 , B23K35/0233 , B23K35/0238 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K2101/40 , B23K2101/42 , C22C13/00 , C22C13/02 , H01L24/29 , H01L24/83 , H01L2224/29101 , H01L2224/29105 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29117 , H01L2224/29123 , H01L2224/29124 , H01L2224/29138 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29149 , H01L2224/29155 , H01L2224/29157 , H01L2224/2916 , H01L2224/29163 , H01L2224/29166 , H01L2224/29169 , H01L2224/29171 , H01L2224/29172 , H01L2224/2918 , H01L2224/83815 , H01L2924/01015 , H01L2924/0102 , H01L2924/01032 , H01L2924/01034 , H01L2924/01052 , H01L2924/01058
摘要： A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.
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公开(公告)号：US20220169905A1
公开(公告)日：2022-06-02
申请号：US17493247
申请日：2021-10-04
发明人： Shamik Ghosal , Ranjit Pandher , Oscar Khaselev , Ravi Bhatkal , Rahul Raut , Bawa Singh , Morgana de Avila Ribas , Siuli Sarkar , Sutapa Mukherjee , Sathish Kumar , Remya Chandran , Pavan Vishwanath , Ashok Pachamuthu , Monnir Boureghda , Nitin Desai , Anna Lifton , Nirmalya Kumar Chaki
IPC分类号： C09K5/14 , C01G5/00 , C09C1/62 , C09C3/08 , B82Y30/00 , B22F1/05 , B22F1/16 , B22F1/052 , B22F1/102
摘要： A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
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公开(公告)号：US10894302B2
公开(公告)日：2021-01-19
申请号：US15318895
申请日：2015-06-22
发明人： Shamik Ghoshal , Remya Chandran , Sutapa Mukherjee , Siuli Sarkar , Ranjit Pandher , Bawa Singh
摘要： A sintering powder, wherein a least a portion of the particles making up the sintering powder comprise: a core comprising a first material; and a shell at least partially coating the core, the shell comprising a second material having a lower oxidation potential than the first material.
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公开(公告)号：US20190194517A1
公开(公告)日：2019-06-27
申请号：US16289789
申请日：2019-03-01
发明人： Shamik Ghosal , Ranjit Pandher , Oscar Khaselev , Ravi Bhatkal , Rahul Raut , Bawa Singh , Morgana de Avila Ribas , Siuli Sarkar , Sutapa Mukherjee , Sathish Kumar , Remya Chandran , Pavan Vishwanath , Ashok Pachamuthu , Monnir Boureghda , Nitin Desai , Anna Lifton , Nirmalya Kumar Chaki
CPC分类号： C09K5/14 , B22F1/0011 , B22F1/0014 , B22F1/0018 , B22F1/0062 , B22F1/0074 , B22F1/02 , B22F2001/0066 , B82Y30/00 , C01G5/00 , C01P2002/72 , C01P2002/88 , C01P2004/04 , C01P2004/53 , C01P2004/61 , C01P2004/64 , C01P2006/22 , C01P2006/32 , C01P2006/40 , C09C1/62 , C09C3/08 , H01L2924/0002 , H01L2924/00
摘要： A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
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公开(公告)号：US11162007B2
公开(公告)日：2021-11-02
申请号：US16289789
申请日：2019-03-01
发明人： Shamik Ghosal , Ranjit Pandher , Oscar Khaselev , Ravi Bhatkal , Rahul Raut , Bawa Singh , Morgana de Avila Ribas , Siuli Sarkar , Sutapa Mukherjee , Sathish Kumar , Remya Chandran , Pavan Vishwanath , Ashok Pachamuthu , Monnir Boureghda , Nitin Desai , Anna Lifton , Nirmalya Kumar Chaki
摘要： A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
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公开(公告)号：US10682732B2
公开(公告)日：2020-06-16
申请号：US15562195
申请日：2016-03-31
发明人： Ramakrishna Hosur Venkatagiriyappa , Morgana De Avila Ribas , Barun Das , Harish Hanchina Siddappa , Sutapa Mukherjee , Siuli Sarkar , Bawa Singh , Rahul Raut , Ranjit Pandher
IPC分类号： C09J163/00 , C08L63/00 , C08K3/00 , C08K3/04 , C08K3/34 , C08K5/54 , C08K9/00 , B23K35/36 , B23K1/00 , B23K35/02 , H01L23/29 , H01L23/00 , C08K5/00 , C08K3/013 , B23K1/20 , C08K7/02 , B23K35/00 , C08K5/549 , B32B27/38 , B23K101/42
摘要： A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.
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