Invention Grant
- Patent Title: Electrically conductive copper components and joining processes therefor
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Application No.: US15659003Application Date: 2017-07-25
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Publication No.: US10892671B2Publication Date: 2021-01-12
- Inventor: Hongliang Wang , Chen Zhou , Xingcheng Xiao
- Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Applicant Address: US MI Detroit
- Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Current Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Current Assignee Address: US MI Detroit
- Agency: Quinn IP Law
- Main IPC: H02K15/02
- IPC: H02K15/02 ; B23K26/00 ; B23K26/352 ; C23C4/12 ; H02K3/50 ; H02K3/14 ; B23K26/354 ; C23C24/04 ; C23C4/08 ; B23K11/18 ; B23K11/11 ; B23K26/0622 ; B23K26/282 ; H02K1/16 ; B23K101/36 ; B23K103/12 ; B23K101/42 ; B23K101/34
Abstract:
Methods of manufacturing electrically conductive copper components for electric devices and method of joining electrically conductive copper components are provided. Each of the electrically conductive copper components are manufactured to include a preexisting coating of joining material located on or adjacent to a joining surface thereof.
Public/Granted literature
- US20190036429A1 ELECTRICALLY CONDUCTIVE COPPER COMPONENTS AND JOINING PROCESSES THEREFOR Public/Granted day:2019-01-31
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