Invention Grant
- Patent Title: Light emitting diode for surface mount technology, method of manufacturing the same, and method of manufacturing light emitting diode module
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Application No.: US16889525Application Date: 2020-06-01
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Publication No.: US10991851B2Publication Date: 2021-04-27
- Inventor: Jong Hyeon Chae , Jong Min Jang , Won Young Roh , Dae Woong Suh , Min Woo Kang , Joon Sub Lee , Hyun A. Kim
- Applicant: SEOUL VIOSYS CO., LTD.
- Applicant Address: KR Ansan-si
- Assignee: SEOUL VIOSYS CO., LTD.
- Current Assignee: SEOUL VIOSYS CO., LTD.
- Current Assignee Address: KR Ansan-si
- Agency: Perkins Coie LLP
- Priority: KR10-2012-0070129 20120628
- Main IPC: H01L33/40
- IPC: H01L33/40 ; H01L33/44 ; H01L33/46 ; H01L33/00 ; H01L33/48 ; H01L33/60 ; H01L33/62 ; H01L33/12 ; H01L33/06 ; H01L33/32 ; H01L33/20 ; H01L33/38

Abstract:
Provided are a light emitting diode (LED) in which a conductive barrier layer surrounding a reflective metal layer is defined by a protective insulating layer, and a method of manufacturing the same. A reflection pattern including a reflective metal layer and a conductive barrier layer is formed on an emission structure in which a first semiconductor layer, an active layer, and a second semiconductor layer are formed. The conductive barrier layer prevents diffusion of a reflective metal layer and extends to a protective insulating layer recessed under a photoresist pattern having an overhang structure during a forming process. Accordingly, a phenomenon where the conductive barrier layer is in contact with sidewalls of the photoresist pattern having an over-hang structure and the reflective metal layer forms points is prevented. Thus, LED modules having various shapes may be manufactured.
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