Invention Grant
- Patent Title: Resin composition and method for manufacturing thermally conductive material
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Application No.: US16146084Application Date: 2018-09-28
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Publication No.: US11015018B2Publication Date: 2021-05-25
- Inventor: Yen-Chun Liu , Min-Chian Wang , Hsiang-Yen Tsao , Kuo-Chan Chiou
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW107100633 20180108
- Main IPC: C08G59/52
- IPC: C08G59/52 ; C08G59/50 ; C08K3/22 ; C08G59/22 ; C08G59/24 ; C08G59/56 ; C09D163/00 ; C09K5/14 ; C08L63/00 ; C08K3/08 ; C08K3/013
Abstract:
A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.
Public/Granted literature
- US20190211138A1 RESIN COMPOSITION AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE MATERIAL Public/Granted day:2019-07-11
Information query
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