公开(公告)号：US11015018B2

公开(公告)日：2021-05-25

申请号：US16146084

申请日：2018-09-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yen-Chun Liu ,  Min-Chian Wang ,  Hsiang-Yen Tsao ,  Kuo-Chan Chiou

IPC: C08G59/52 ,  C08G59/50 ,  C08K3/22 ,  C08G59/22 ,  C08G59/24 ,  C08G59/56 ,  C09D163/00 ,  C09K5/14 ,  C08L63/00 ,  C08K3/08 ,  C08K3/013

Abstract: A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.

公开(公告)号：US10329468B2

公开(公告)日：2019-06-25

申请号：US15046973

申请日：2016-02-18

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yen-Chun Liu ,  Hui-Wen Chang ,  Min-Chian Wang ,  Kuo-Chan Chiou

IPC: C09K5/14 ,  C08G73/10 ,  C08L79/08 ,  C08G73/14 ,  C08K3/34 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38

Abstract: A thermally conductive resin is provided. The thermally conductive resin has the formula In the formula, X1 is X2 is m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.