Invention Grant
- Patent Title: Semiconductor structure with doped contact plug and method for forming the same
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Application No.: US15939389Application Date: 2018-03-29
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Publication No.: US11145751B2Publication Date: 2021-10-12
- Inventor: Kuo-Ju Chen , Su-Hao Liu , Chun-Hao Kung , Liang-Yin Chen , Huicheng Chang , Kei-Wei Chen , Hui-Chi Huang , Kao-Feng Liao , Chih-Hung Chen , Jie-Huang Huang , Lun-Kuang Tan , Wei-Ming You
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/417 ; H01L29/78

Abstract:
A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a gate structure, a source/drain structure, a dielectric layer, a contact plug. The gate structure is positioned over a fin structure. The source/drain structure is positioned in the fin structure and adjacent to the gate structure. The dielectric layer is positioned over the gate structure and the source/drain structure. The contact plug is positioned passing through the dielectric layer. The contact plug includes a first metal compound including one of group III elements, group IV elements, group V elements or a combination thereof.
Public/Granted literature
- US20190305107A1 SEMICONDUCTOR STRUCTURE WITH DOPED CONTACT PLUG AND METHOD FOR FORMING THE SAME Public/Granted day:2019-10-03
Information query
IPC分类: