发明授权
- 专利标题: Semiconductor structure with doped contact plug and method for forming the same
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申请号: US15939389申请日: 2018-03-29
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公开(公告)号: US11145751B2公开(公告)日: 2021-10-12
- 发明人: Kuo-Ju Chen , Su-Hao Liu , Chun-Hao Kung , Liang-Yin Chen , Huicheng Chang , Kei-Wei Chen , Hui-Chi Huang , Kao-Feng Liao , Chih-Hung Chen , Jie-Huang Huang , Lun-Kuang Tan , Wei-Ming You
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: McClure, Qualey & Rodack, LLP
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L29/417 ; H01L29/78
摘要:
A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a gate structure, a source/drain structure, a dielectric layer, a contact plug. The gate structure is positioned over a fin structure. The source/drain structure is positioned in the fin structure and adjacent to the gate structure. The dielectric layer is positioned over the gate structure and the source/drain structure. The contact plug is positioned passing through the dielectric layer. The contact plug includes a first metal compound including one of group III elements, group IV elements, group V elements or a combination thereof.
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