- Patent Title: Per chiplet thermal control in a disaggregated multi-chiplet system
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Application No.: US16551523Application Date: 2019-08-26
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Publication No.: US11175709B2Publication Date: 2021-11-16
- Inventor: Amit Kumar Jain , Sameer Shekhar , Mark Carbone , Merwin M. Brown
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- Main IPC: G06F1/32
- IPC: G06F1/32 ; G06F1/20 ; G06F1/3296 ; G06F1/324 ; G06F1/3206

Abstract:
Particular embodiments described herein provide for an electronic device that can be configured to include a plurality of chiplets, a plurality of resources, a system thermal engine, and at least one processor. The at least one processor is configured to cause the system thermal engine to monitor the plurality of chiplets, where the plurality of chiplets are part of a multi-chip module, determine that a first chiplet from the plurality of chiplets has reached a threshold temperature, and reduce power to the first chiplet without reducing power to the other chiplets in the plurality of chiplets.
Public/Granted literature
- US20190384367A1 PER CHIPLET THERMAL CONTROL IN A DISAGGREGATED MULTI-CHIPLET SYSTEM Public/Granted day:2019-12-19
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