公开(公告)号：US11175709B2

公开(公告)日：2021-11-16

申请号：US16551523

申请日：2019-08-26

Applicant: Intel Corporation

Inventor： Amit Kumar Jain ,  Sameer Shekhar ,  Mark Carbone ,  Merwin M. Brown

IPC: G06F1/32 ,  G06F1/20 ,  G06F1/3296 ,  G06F1/324 ,  G06F1/3206

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a plurality of chiplets, a plurality of resources, a system thermal engine, and at least one processor. The at least one processor is configured to cause the system thermal engine to monitor the plurality of chiplets, where the plurality of chiplets are part of a multi-chip module, determine that a first chiplet from the plurality of chiplets has reached a threshold temperature, and reduce power to the first chiplet without reducing power to the other chiplets in the plurality of chiplets.

公开(公告)号：US20190384367A1

公开(公告)日：2019-12-19

申请号：US16551523

申请日：2019-08-26

Applicant: Intel Corporation

Inventor： Amit Kumar Jain ,  Sameer Shekhar ,  Mark Carbone ,  Merwin M. Brown

IPC: G06F1/20 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a plurality of chiplets, a plurality of resources, a system thermal engine, and at least one processor. The at least one processor is configured to cause the system thermal engine to monitor the plurality of chiplets, where the plurality of chiplets are part of a multi-chip module, determine that a first chiplet from the plurality of chiplets has reached a threshold temperature, and reduce power to the first chiplet without reducing power to the other chiplets in the plurality of chiplets.