Invention Grant
- Patent Title: Slurry composition and method of manufacturing integrated circuit device by using the same
-
Application No.: US16879283Application Date: 2020-05-20
-
Publication No.: US11186749B2Publication Date: 2021-11-30
- Inventor: Boyun Kim , Yeryung Jeon , Boun Yoon , Taek Dong Chung , Jae Gyeong Lee , Jin-Young Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD. , SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
- Applicant Address: KR Suwon-si; KR Seoul
- Assignee: SAMSUNG ELECTRONICS CO., LTD.,SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.,SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
- Current Assignee Address: KR Suwon-si; KR Seoul
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2019-0071069 20190614
- Main IPC: C09G1/02
- IPC: C09G1/02 ; C09G1/04 ; C09K15/02 ; H01L21/768 ; H01L21/321 ; C09G1/00 ; H01L21/306 ; C09K3/14 ; B24B1/00 ; C09G1/06 ; C09K13/06 ; B24B37/04
Abstract:
A slurry composition is disclosed which includes: a corrosion inhibitor including a material selected from carbon allotropes and derivatives thereof; and an oxidant. A method of manufacturing an integrated circuit device is disclosed which includes: forming a first metal film and a second metal film on a substrate, the first metal film and the second metal film respectively including different metals; and polishing, by using the slurry composition, a polishing target surface at which the first metal film and the second metal film are exposed.
Information query
