Invention Grant
- Patent Title: Multi-level CPU high current protection
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Application No.: US15589769Application Date: 2017-05-08
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Publication No.: US11307628B2Publication Date: 2022-04-19
- Inventor: Efraim Rotem , Nir Rosenzweig , Doron Rajwan , Alon Naveh , Eliezer Weissmann
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Spectrum IP Law Group LLC
- Main IPC: G06F1/32
- IPC: G06F1/32 ; G06F1/3206 ; G06F1/3203 ; G06F1/26

Abstract:
Methods and apparatus relating to multi-level CPU (Central Processing Unit) high current protection are described. In one embodiment, different workloads may be assigned different license types and/or weights based on micro-architectural events (such as uop (micro-operation) types and sizes) and/or data types. Other embodiments are also disclosed and claimed.
Public/Granted literature
- US20170308146A1 MULTI-LEVEL CPU HIGH CURRENT PROTECTION Public/Granted day:2017-10-26
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