发明授权
- 专利标题： Method of producing electroconductive substrate, electronic device and display device
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申请号： US16997092申请日： 2020-08-19
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公开(公告)号： US11410855B2公开(公告)日： 2022-08-09
- 发明人: Takashi Daitoku , Susumu Taniguchi , Akiko Seki , Atsushi Sato , Yuhei Horikawa , Makoto Orikasa , Hisayuki Abe
- 申请人： TDK CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： TDK CORPORATION
- 当前专利权人： TDK CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Oliff PLC
- 优先权： JPJP2017-146671 20170728
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; G03F7/00 ; H01L33/62 ; C23C18/18 ; C23C18/20 ; C23C18/16 ; C23C18/30 ; C23C18/31 ; H01L23/00 ; C23C18/38 ; H01L25/075
摘要：
A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.
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