公开(公告)号：US11031330B2

公开(公告)日：2021-06-08

申请号：US16811018

申请日：2020-03-06

Applicant: TDK CORPORATION

Inventor： Takashi Daitoku ,  Susumu Taniguchi ,  Akiko Seki ,  Atsushi Sato ,  Yuhei Horikawa ,  Makoto Orikasa ,  Hisayuki Abe

IPC: H01L23/498 ,  H01L33/62 ,  H05K1/09 ,  H01L21/48 ,  H05K3/40 ,  G06F3/044

Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

公开(公告)号：US11410855B2

公开(公告)日：2022-08-09

申请号：US16997092

申请日：2020-08-19

Applicant: TDK CORPORATION

Inventor： Takashi Daitoku ,  Susumu Taniguchi ,  Akiko Seki ,  Atsushi Sato ,  Yuhei Horikawa ,  Makoto Orikasa ,  Hisayuki Abe

IPC: H01L21/48 ,  G03F7/00 ,  H01L33/62 ,  C23C18/18 ,  C23C18/20 ,  C23C18/16 ,  C23C18/30 ,  C23C18/31 ,  H01L23/00 ,  C23C18/38 ,  H01L25/075

Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

公开(公告)号：US10784122B2

公开(公告)日：2020-09-22

申请号：US16038711

申请日：2018-07-18

Applicant: TDK CORPORATION

Inventor： Takashi Daitoku ,  Susumu Taniguchi ,  Akiko Seki ,  Atsushi Sato ,  Yuhei Horikawa ,  Makoto Orikasa ,  Hisayuki Abe

IPC: H01L21/48 ,  C23C18/20 ,  H01L33/62 ,  G03F7/00 ,  C23C18/18 ,  C23C18/16 ,  C23C18/30 ,  C23C18/31 ,  C23C18/38 ,  H01L23/00 ,  H01L25/075

Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

公开(公告)号：US11869834B2

公开(公告)日：2024-01-09

申请号：US17314187

申请日：2021-05-07

Applicant: TDK CORPORATION

Inventor： Takashi Daitoku ,  Susumu Taniguchi ,  Akiko Seki ,  Atsushi Sato ,  Yuhei Horikawa ,  Makoto Orikasa ,  Hisayuki Abe

IPC: H01L23/498 ,  H01L33/62 ,  H05K1/09 ,  H01L21/48 ,  H05K3/40 ,  G06F3/044

CPC classification number: H01L23/49838 ,  G06F3/044 ,  H01L21/4857 ,  H01L23/49866 ,  H01L33/62 ,  H05K1/09 ,  H05K3/4007 ,  H01L2933/0066 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2203/04

Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.