Invention Grant
- Patent Title: Electrochemical layer deposition
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Application No.: US17227726Application Date: 2021-04-12
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Publication No.: US11591705B2Publication Date: 2023-02-28
- Inventor: David Forrest Pain , David Morgan Wirth , Jeffrey William Herman
- Applicant: Fabric8Labs, Inc.
- Applicant Address: US CA San Diego
- Assignee: Fabric8Labs, Inc.
- Current Assignee: Fabric8Labs, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Dergosits & Noah LLP
- Main IPC: C25D1/00
- IPC: C25D1/00 ; B33Y10/00 ; C25D5/10 ; C25D21/12 ; C25D17/12 ; C25D15/00 ; B33Y30/00 ; B33Y50/02 ; B33Y70/00 ; C25D3/12 ; C25D3/20 ; C25D3/24 ; C25D3/40 ; C25D3/44 ; C25D3/46 ; C25D5/04 ; C25D9/02 ; C25D3/22 ; C25D3/38

Abstract:
An apparatus and method for electrochemically depositing a unitary layer structure using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, an addressing circuit for receiving a signal containing anode address data and for outputting a signal causing an anode array pattern; and, a controller, in communication with the addressing circuit and the anode array, configured to electrically control each anode in the anode array to cause an electrochemical reaction at the cathode that deposits a unitary layer structure according to the anode array pattern signal.
Public/Granted literature
- US20210301414A1 ELECTROCHEMICAL LAYER DEPOSITION Public/Granted day:2021-09-30
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