公开(公告)号：US20240368792A1

公开(公告)日：2024-11-07

申请号：US18772882

申请日：2024-07-15

Applicant: FABRIC8LABS, INC.

Inventor： David Pain ,  Andrew Edmonds ,  Jeffrey Herman ,  Charles Pateros ,  David Wirth ,  Kareemullah Shaik

IPC: C25D1/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

Abstract: Printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts; embodiments utilize a grid of anodes to achieve high quality parts with features that may be small and detailed. To support grids with thousands or millions of anodes, the printhead may use matrix control with row and column drivers similar to display backplanes. Unlike display backplanes where the design goal is to display images using minimal current, the printhead may be optimized for high current density for fast electrodeposition, and for anode longevity. Current density may exceed 1000 mA per cm-squared, at least an order of magnitude greater than that of display backplanes. Anode longevity may be enhanced by using relatively large anodes compared to the grid pitch of the printhead, by lengthening the conductive paths through anodes, or both. Embodiments may be constructed by adding anode and insulation layers on top of matrix-controlled switching circuits.

公开(公告)号：US12104270B2

公开(公告)日：2024-10-01

申请号：US18311888

申请日：2023-05-03

Applicant: FABRIC8LABS, INC.

Inventor： Kareemullah Shaik ,  Andrew Edmonds ,  Ryan Nicholl ,  David Pain

IPC: C25D17/00 ,  C25D3/02 ,  C25D21/14

CPC classification number: C25D3/02 ,  C25D17/007 ,  C25D21/14

Abstract: A method of electroplating a target electrode comprises establishing a first electric current through an electrolytic solution, comprising a quantity of an electrically charged material, an initial electrode, and a transitional electrode, so that a quantity of the electrically charged material is converted to a quantity of an electrically neutral material, which is electroplated, as a deposit, onto the transitional electrode; and establishing a second electric current through the electrolytic solution, the transitional electrode, and the target electrode so that a quantity of the electrically neutral material from the deposit is converted to a quantity of the electrically charged material, which is dissolved into the electrolytic solution, and a quantity of the electrically charged material in the electrolytic solution is converted to a quantity of the electrically neutral material, which is electroplated onto the surface of the target electrode.

公开(公告)号：US20240246299A1

公开(公告)日：2024-07-25

申请号：US18592327

申请日：2024-02-29

Applicant: Fabric8Labs, Inc.

Inventor： David Pain ,  Kareemullah Shaik ,  Joshua Gillespie ,  Jeffrey Herman

IPC: B29C64/393 ,  B29C64/264 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  C25D1/00 ,  C25D17/10 ,  C25D21/12

CPC classification number: B29C64/393 ,  B29C64/264 ,  C25D1/003 ,  C25D17/10 ,  C25D21/12 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

Abstract: Described herein are electrochemical-additive manufacturing methods and systems using such methods. A method comprises depositing a material onto a deposition electrode by flowing a current between that deposition electrode and each of multiple individually-addressable electrodes, forming an electrode array. These currents are independently controlled based on a target map and using deposition control circuits, each coupled to one individually-addressable electrode. The target map is generated by a system controller based on various characteristics of the system (e.g., the performance of each deposition control circuit and/or individually-addressable electrode, electrolyte composition) and the desired characteristics of the deposited material (e.g., deposition location, uniformity, morphology). Furthermore, when the deposition electrode and the electrode array move relative to each other, the system controller dynamically updates the target map based on their relative positions. This movement can provide a fresh electrolyte between the electrodes and enable deposition at new locations.

公开(公告)号：US20240240347A1

公开(公告)日：2024-07-18

申请号：US18620603

申请日：2024-03-28

Applicant: FABRIC8LABS, INC.

Inventor： David Pain ,  Kareem Shaik ,  Charles Pateros

IPC: C25D7/12 ,  C25D5/02 ,  C25D5/48 ,  C25D17/08 ,  C25D17/12 ,  C25D21/12 ,  H05K3/18 ,  H05K3/40

CPC classification number: C25D7/123 ,  C25D5/02 ,  C25D5/48 ,  C25D17/08 ,  C25D17/12 ,  C25D21/12 ,  H05K3/188 ,  H05K3/4038

Abstract: A method of making an electrical component includes transmitting electrical energy from a power source through one or more deposition anodes, through an electrolyte solution, and to an intralayer electrical-connection feature of a build plate, such that material is electrochemically deposited onto the intralayer electrical-connection feature and forms an interlayer electrical-connection feature. The method also includes securing a dielectric material so that the dielectric material contacts and electrically insulates the intralayer electrical-connection feature and contacts and at least partially electrically insulates the interlayer electrical-connection feature. The method additionally includes depositing a seed layer onto the dielectric material and the interlayer electrical-connection feature, electrochemically depositing material onto the seed layer, to form at least one second intralayer electrical-connection feature of the electrical component, and removing any one or more portions of the seed layer onto which no portion of the at least one second intralayer electrical-connection feature is formed.

公开(公告)号：US20240076791A1

公开(公告)日：2024-03-07

申请号：US18165200

申请日：2023-02-06

Applicant: FABRIC8LABS, INC.

Inventor： David Pain ,  Andrew Edmonds

IPC: C25D1/00 ,  B33Y10/00

CPC classification number: C25D1/003 ,  B33Y10/00

Abstract: An electrochemical additive manufacturing method includes coupling a first electronic device to a build plate and positioning the build plate into an electrolyte solution. The method also includes positioning a deposition anode array into the electrolyte solution, connecting the cathode portion of the build plate and one or more deposition anodes of the abide array to a power source. The method also includes transmitting electrical energy from the power source, through the one or more deposition anodes, through the electrolyte solution, and to the cathode portion of the build plate, such that material is deposited onto the cathode portion and forms at least a sidewall of a shell that encases the first electronic device against the build plate when the first electronic device is coupled to the build plate. The shell and the first electronic device form a second electronic device.

公开(公告)号：US11920251B2

公开(公告)日：2024-03-05

申请号：US17903966

申请日：2022-09-06

Applicant: FABRIC8LABS, INC.

Inventor： David Pain ,  Ian Winfield ,  Andrew Edmonds ,  Kareem Shaik ,  Jeffrey Herman ,  Michael Matthews ,  Charles Pateros

IPC: C25D1/00 ,  B33Y10/00 ,  B33Y30/00 ,  C25D5/00 ,  C25D5/10 ,  C25D17/12 ,  C25D21/12

CPC classification number: C25D1/003 ,  C25D5/10 ,  C25D5/60 ,  C25D17/12 ,  C25D21/12 ,  B33Y10/00 ,  B33Y30/00

Abstract: An electrochemical additive manufacturing method includes positioning a build plate into an electrolyte solution. The conductive layer comprises at least one conductive-layer segment forming a pattern corresponding with a component. The method further comprises connecting the at least one conductive-layer segment and one or more deposition anodes to a power source. The one or more deposition anodes correspond with at least a portion of the pattern formed by the at least one conductive-layer segment. The method additionally comprises transmitting electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes corresponding with the at least the portion of the pattern formed by the at least one conductive-layer segment, through the electrolyte solution, and to the at least one conductive-layer segment, such that material is deposited onto the at least one conductive-layer segment and forms at least a portion of the component.

公开(公告)号：US11745432B2

公开(公告)日：2023-09-05

申请号：US18064686

申请日：2022-12-12

Applicant: Fabric8Labs, Inc.

Inventor： David Pain ,  Kareemullah Shaik ,  Joshua Gillespie ,  Jeffrey Herman

IPC: C25D1/00 ,  C25D17/10 ,  C25D21/12 ,  B33Y50/02 ,  B33Y10/00 ,  B33Y30/00 ,  B29C64/393 ,  B29C64/264

CPC classification number: B29C64/393 ,  B29C64/264 ,  C25D1/003 ,  C25D17/10 ,  C25D21/12 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

Abstract: Described herein are electrochemical-additive manufacturing methods and systems using such methods. A method comprises depositing a material onto a deposition electrode by flowing a current between that deposition electrode and each of multiple individually-addressable electrodes, forming an electrode array. These currents are independently controlled based on a target map and using deposition control circuits, each coupled to one individually-addressable electrode. The target map is generated by a system controller based on various characteristics of the system (e.g., the performance of each deposition control circuit and/or individually-addressable electrode, electrolyte composition) and the desired characteristics of the deposited material (e.g., deposition location, uniformity, morphology). Furthermore, when the deposition electrode and the electrode array move relative to each other, the system controller dynamically updates the target map based on their relative positions. This movement can provide a fresh electrolyte between the electrodes and enable deposition at new locations.

公开(公告)号：US20220084840A1

公开(公告)日：2022-03-17

申请号：US17535437

申请日：2021-11-24

Applicant: FABRIC8LABS, INC.

Inventor： David Pain ,  Andrew Edmonds ,  Jeffrey Herman ,  Charles Pateros ,  Kareemullah Shaik

IPC: H01L21/48 ,  C25D1/00 ,  C25D5/10 ,  C25D5/22

Abstract: A system and method of using electrochemical additive manufacturing to add interconnection features, such as wafer bumps or pillars, or similar structures like heatsinks, to a plate such as a silicon wafer. The plate may be coupled to a cathode, and material for the features may be deposited onto the plate by transmitting current from an anode array through an electrolyte to the cathode. Position actuators and sensors may control the position and orientation of the plate and the anode array to place features in precise positions. Use of electrochemical additive manufacturing may enable construction of features that cannot be created using current photoresist-based methods. For example, pillars may be taller and more closely spaced, with heights of 200 μm or more, diameters of 10 μm or below, and inter-pillar spacing below 20 μm. Features may also extend horizontally instead of only vertically, enabling routing of interconnections to desired locations.

公开(公告)号：US11232956B2

公开(公告)日：2022-01-25

申请号：US17112909

申请日：2020-12-04

Applicant: FABRIC8LABS, INC.

Inventor： David Pain ,  Andrew Edmonds ,  Jeffrey Herman ,  Charles Pateros ,  Kareemullah Shaik

IPC: H01L21/48 ,  C25D1/00 ,  C25D5/10 ,  C25D5/22 ,  B33Y50/02 ,  B33Y80/00 ,  B33Y10/00 ,  B33Y30/00

Abstract: A system and method of using electrochemical additive manufacturing to add interconnection features, such as wafer bumps or pillars, or similar structures like heatsinks, to a plate such as a silicon wafer. The plate may be coupled to a cathode, and material for the features may be deposited onto the plate by transmitting current from an anode array through an electrolyte to the cathode. Position actuators and sensors may control the position and orientation of the plate and the anode array to place features in precise positions. Use of electrochemical additive manufacturing may enable construction of features that cannot be created using current photoresist-based methods. For example, pillars may be taller and more closely spaced, with heights of 200 μm or more, diameters of 10 μm or below, and inter-pillar spacing below 20 μm. Features may also extend horizontally instead of only vertically, enabling routing of interconnections to desired locations.

公开(公告)号：US10975485B2

公开(公告)日：2021-04-13

申请号：US16432857

申请日：2019-06-05

Applicant: Fabric8Labs, Inc.

Inventor： David Forrest Pain ,  David Morgan Wirth ,  Jeffrey William Herman

IPC: C25D1/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  C25D5/04 ,  C25D5/10 ,  C25D21/12 ,  C25D17/12 ,  C25D15/00 ,  B33Y70/00 ,  C25D3/12 ,  C25D3/20 ,  C25D3/24 ,  C25D3/40 ,  C25D3/44 ,  C25D3/46 ,  C25D9/02 ,  C25D3/22 ,  C25D3/38

Abstract: An apparatus and method for electrochemically depositing a unitary layer structure using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, an addressing circuit for receiving a signal containing anode address data and for outputting a signal causing an anode array pattern; and, a controller. in communication with the addressing circuit and the anode array, configured to electrically control each anode in the anode array to cause an electrochemical reaction at the cathode that deposits a unitary layer structure according to the anode array pattern signal.