Invention Grant
- Patent Title: External heating system for use in chemical mechanical polishing system
-
Application No.: US16573957Application Date: 2019-09-17
-
Publication No.: US11633829B2Publication Date: 2023-04-25
- Inventor: Yi-Sheng Lin , Chi-Hsiang Shen , Chi-Jen Liu , Chun-Wei Hsu , Yang-Chun Cheng , Kei-Wei Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Seed IP Law Group LLP
- Main IPC: B24B37/015
- IPC: B24B37/015 ; B24B37/20 ; B24B53/017 ; B24B57/02 ; B24B49/14
Abstract:
A chemical mechanical polishing (CMP) system includes a polishing pad configured to polish a substrate. The CMP system further includes a heating system configured to adjust a temperature of the polishing pad. The heating system comprises at least one heating element spaced apart from the polishing pad. The CMP system further includes a sensor configured to measure the temperature of the polishing pad.
Public/Granted literature
- US20210078129A1 EXTERNAL HEATING SYSTEM FOR USE IN CHEMICAL MECHANICAL POLISHING SYSTEM Public/Granted day:2021-03-18
Information query
