Invention Grant
- Patent Title: Integrate rinse module in hybrid bonding platform
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Application No.: US17655638Application Date: 2022-03-21
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Publication No.: US11854795B2Publication Date: 2023-12-26
- Inventor: Xin-Hua Huang , Ping-Yin Liu , Hung-Hua Lin , Hsun-Chung Kuang , Yuan-Chih Hsieh , Lan-Lin Chao , Chia-Shiung Tsai , Xiaomeng Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- The original application number of the division: US16569019 2019.09.12
- Main IPC: B23K1/00
- IPC: B23K1/00 ; H01L21/02 ; B23K1/20 ; B23K20/02 ; B23K20/233 ; B23K20/24 ; H01L23/00 ; B23K101/40 ; B23K101/42
Abstract:
A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.
Public/Granted literature
- US20220216052A1 Integrate Rinse Module in Hybrid Bonding Platform Public/Granted day:2022-07-07
Information query
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