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    METHOD OF IMPROVING GETTER EFFICIENCY BY INCREASING SUPERFICIAL AREA
    4.
    发明申请
    METHOD OF IMPROVING GETTER EFFICIENCY BY INCREASING SUPERFICIAL AREA 有权
    通过增加超级区域提高效率的方法

    公开(公告)号：US20160101976A1

    公开(公告)日：2016-04-14

    申请号：US14967663

    申请日：2015-12-14

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Yuan-Chih Hsieh ,  Li-Cheng Chu ,  Hung-Hua Lin ,  Chih-Jen Chan ,  Lan-Lin Chao

    IPC: B81B7/00

    CPC classification number: B81B7/0038 ,  B81B7/0025 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0315 ,  B81C1/00285 ,  B81C2203/0118 ,  H01L21/3223 ,  H01L23/26 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: In some embodiments, the present disclosure relates to a MEMs (micro-electromechanical system) package device having a getter layer. The MEMs package includes a first substrate having a cavity located within an upper surface of the first substrate. The cavity has roughened interior surfaces. A getter layer is arranged onto the roughened interior surfaces of the cavity. A bonding layer is arranged on the upper surface of the first substrate on opposing sides of the cavity, and a second substrate bonded to the first substrate by the bonding layer. The second substrate is arranged over the cavity. The roughened interior surfaces of the cavity enables more effective absorption of residual gases, thereby increasing the efficiency of a gettering process.

    Abstract translation: 在一些实施例中，本公开涉及具有吸气剂层的MEM（微机电系统）包装装置。 MEM包装包括具有位于第一衬底的上表面内的空腔的第一衬底。 腔内表面粗糙。 吸气剂层布置在空腔的粗糙化的内表面上。 在空腔的相对侧的第一基板的上表面上配置有接合层，通过接合层与第一基板接合的第二基板。 第二基板布置在空腔上方。 空腔的粗糙化的内表面能够更有效地吸收残留气体，从而提高吸气过程的效率。

    Method of improving getter efficiency by increasing superficial area
    5.
    发明授权
    Method of improving getter efficiency by increasing superficial area 有权
    通过增加表面积来提高吸气效率的方法

    公开(公告)号：US09242853B2

    公开(公告)日：2016-01-26

    申请号：US14053751

    申请日：2013-10-15

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Yuan-Chih Hsieh ,  Li-Cheng Chu ,  Hung-Hua Lin ,  Chih-Jen Chan ,  Lan-Lin Chao

    IPC: H01L23/31 ,  B81C1/00 ,  H01L23/26 ,  H01L21/322 ,  B81B7/00

    CPC classification number: B81B7/0038 ,  B81B7/0025 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0315 ,  B81C1/00285 ,  B81C2203/0118 ,  H01L21/3223 ,  H01L23/26 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The present disclosure relates to a method of gettering that provides for a high efficiency gettering process by depositing a gettering material on a roughened substrate surface, and an associated apparatus. In some embodiments, the method is performed by providing a substrate into a processing chamber having residual gases. One or more cavities are formed in the substrate at locations between bonding areas on a top surface of the substrate. Respective cavities have roughened interior surfaces that vary in a plurality of directions. A getter layer is deposited into the one or more cavities. The roughened interior surfaces of the one or more cavities enable the substrate to more effectively absorb the residual gases, thereby increasing the efficiency of the gettering process.

    Abstract translation: 本公开涉及一种吸气方法，其通过在粗糙化的基底表面上沉积吸气材料和相关联的装置来提供高效吸气过程。 在一些实施例中，通过将衬底提供到具有残留气体的处理室中来执行该方法。 在衬底的顶部表面上的结合区域之间的位置处形成一个或多个空腔。 相应的空腔具有在多个方向上变化的内表面的粗糙化。 吸气剂层沉积到一个或多个空腔中。 一个或多个空腔的粗糙化的内表面使得基底能够更有效地吸收残余气体，从而提高吸气过程的效率。

    Transfer Module for Bowed Wafers
    6.
    发明申请
    Transfer Module for Bowed Wafers 有权
    弓形晶圆转移模块

    公开(公告)号：US20150155196A1

    公开(公告)日：2015-06-04

    申请号：US14096217

    申请日：2013-12-04

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Ming-Tung Wu ,  Yuan- Chih Hsieh ,  Lan-Lin Chao ,  Chia-Shiung Tsai

    IPC: H01L21/683 ,  H01L21/687 ,  B24B37/34

    CPC classification number: H01L21/6838 ,  B24B37/30 ,  B24B37/345 ,  B24B41/005 ,  H01L21/67288 ,  H01L21/68707 ,  H01L21/68764 ,  H01L21/68771

    Abstract: A wafer grinding system includes a robot arm having a suction board at one end and a table within reach of the robot arm. An upper surface of the table has a vacuum surface for sucking and holding wafers. A pusher coupled to the robot arm extends about the periphery of the suction board. The pusher flattens wafers against the upper surface of the table, allowing the table to hold by suction wafers that would otherwise be too bowed to be held in that way. Additionally, a table can have a vacuum area that is small in comparison to the wafers, which is another way of increasing the magnitude of wafer bow that can be tolerated. A grinding system can use the reduced vacuum area concept to allow the positioning table to hold bowed wafers and the pusher concept to allow the chuck tables to hold bowed wafers.

    Abstract translation: 晶片研磨系统包括机器人臂，其在一端具有吸引板，在机器人手臂的范围内具有桌子。 桌子的上表面具有用于吸取和保持晶片的真空表面。 联接到机器人臂的推动器围绕吸板的周边延伸。 推动器将晶片压平在桌子的上表面上，允许桌子由吸着的晶片保持，否则将被过度弯曲而不能以这种方式保持。 此外，桌子可以具有与晶片相比较小的真空区域，这是增加可以容忍的晶片弓的大小的另一种方式。 研磨系统可以使用减小的真空区域概念来允许定位台保持弓形晶片和推动器概念，以允许卡盘台保持弯曲的晶片。

    Transfer module for bowed wafers
    7.
    发明授权
    Transfer module for bowed wafers 有权
    用于鞠躬的转移模块

    公开(公告)号：US09355882B2

    公开(公告)日：2016-05-31

    申请号：US14096217

    申请日：2013-12-04

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Ming-Tung Wu ,  Yuan-Chih Hsieh ,  Lan-Lin Chao ,  Chia-Shiung Tsai

    IPC: H01L21/683 ,  B24B37/34 ,  H01L21/687 ,  B24B37/30 ,  B24B41/00 ,  H01L21/67

    CPC classification number: H01L21/6838 ,  B24B37/30 ,  B24B37/345 ,  B24B41/005 ,  H01L21/67288 ,  H01L21/68707 ,  H01L21/68764 ,  H01L21/68771

    Abstract: A wafer grinding system includes a robot arm having a suction board at one end and a table within reach of the robot arm. An upper surface of the table has a vacuum surface for sucking and holding wafers. A pusher coupled to the robot arm extends about the periphery of the suction board. The pusher flattens wafers against the upper surface of the table, allowing the table to hold by suction wafers that would otherwise be too bowed to be held in that way. Additionally, a table can have a vacuum area that is small in comparison to the wafers, which is another way of increasing the magnitude of wafer bow that can be tolerated. A grinding system can use the reduced vacuum area concept to allow the positioning table to hold bowed wafers and the pusher concept to allow the chuck tables to hold bowed wafers.

    Abstract translation: 晶片研磨系统包括机器人臂，其在一端具有吸引板，在机器人手臂的范围内具有桌子。 桌子的上表面具有用于吸取和保持晶片的真空表面。 联接到机器人臂的推动器围绕吸板的周边延伸。 推动器使晶片抵靠桌子的上表面平坦化，从而允许桌子由吸着的晶片保持，否则将被太鞠躬不能以这种方式保持。 此外，桌子可以具有与晶片相比较小的真空区域，这是增加可以容忍的晶片弓的大小的另一种方式。 研磨系统可以使用减小的真空区域概念来允许定位台保持弓形晶片和推动器概念，以允许卡盘台保持弯曲的晶片。

    Method of Improving Getter Efficiency by Increasing Superficial Area
    10.
    发明申请
    Method of Improving Getter Efficiency by Increasing Superficial Area 有权
    通过增加表面积来提高吸气效率的方法

    公开(公告)号：US20150102432A1

    公开(公告)日：2015-04-16

    申请号：US14053751

    申请日：2013-10-15

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Yuan-Chih Hsieh ,  Li-cheng Chu ,  Hung-Hua Lin ,  Chih-Jen Chan ,  Lan-Lin Chao

    IPC: B81C1/00 ,  H01L21/322 ,  B81B7/00 ,  H01L23/26

    CPC classification number: B81B7/0038 ,  B81B7/0025 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0315 ,  B81C1/00285 ,  B81C2203/0118 ,  H01L21/3223 ,  H01L23/26 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The present disclosure relates to a method of gettering that provides for a high efficiency gettering process by depositing a gettering material on a roughened substrate surface, and an associated apparatus. In some embodiments, the method is performed by providing a substrate into a processing chamber having residual gases. One or more cavities are formed in the substrate at locations between bonding areas on a top surface of the substrate. Respective cavities have roughened interior surfaces that vary in a plurality of directions. A getter layer is deposited into the one or more cavities. The roughened interior surfaces of the one or more cavities enable the substrate to more effectively absorb the residual gases, thereby increasing the efficiency of the gettering process.

    Abstract translation: 本公开涉及一种吸气方法，其通过在粗糙化的基底表面上沉积吸气材料和相关联的装置来提供高效吸气过程。 在一些实施例中，通过将衬底提供到具有残留气体的处理室中来执行该方法。 在衬底的顶部表面上的结合区域之间的位置处形成一个或多个空腔。 相应的空腔具有在多个方向上变化的内表面的粗糙化。 吸气剂层沉积到一个或多个空腔中。 一个或多个空腔的粗糙化的内表面使得基底能够更有效地吸收残余气体，从而提高吸气过程的效率。

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