- 专利标题： Two-stage bake photoresist with releasable quencher
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申请号： US17701367申请日： 2022-03-22
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公开(公告)号： US11955343B2公开(公告)日： 2024-04-09
- 发明人: Robert L. Bristol , Marie Krysak , James M. Blackwell , Florian Gstrein , Kent N. Frasure
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Schwabe, Williamson & Wyatt, P.C.
- 分案原申请号： US16075555
- 主分类号： G03F7/039
- IPC分类号： G03F7/039 ; G03F7/004 ; G03F7/20 ; G03F7/38 ; H01L21/027 ; H01L21/033 ; H01L21/311 ; H01L21/768
摘要：
Two-stage bake photoresists with releasable quenchers for fabricating back end of line (BEOL) interconnects are described. In an example, a photolyzable composition includes an acid-deprotectable photoresist material having substantial transparency at a wavelength, a photo-acid-generating (PAG) component having substantial transparency at the wavelength, and a base-generating component having substantial absorptivity at the wavelength.
公开/授权文献
- US20220216065A1 TWO-STAGE BAKE PHOTORESIST WITH RELEASABLE QUENCHER 公开/授权日：2022-07-07
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