公开(公告)号：US11955343B2

公开(公告)日：2024-04-09

申请号：US17701367

申请日：2022-03-22

申请人： Intel Corporation

发明人： Robert L. Bristol ,  Marie Krysak ,  James M. Blackwell ,  Florian Gstrein ,  Kent N. Frasure

IPC分类号： G03F7/039 ,  G03F7/004 ,  G03F7/20 ,  G03F7/38 ,  H01L21/027 ,  H01L21/033 ,  H01L21/311 ,  H01L21/768

CPC分类号： H01L21/31144 ,  G03F7/0045 ,  G03F7/0392 ,  G03F7/203 ,  G03F7/38 ,  H01L21/0273 ,  H01L21/0337 ,  H01L21/76801 ,  H01L21/76808 ,  H01L21/76816

摘要： Two-stage bake photoresists with releasable quenchers for fabricating back end of line (BEOL) interconnects are described. In an example, a photolyzable composition includes an acid-deprotectable photoresist material having substantial transparency at a wavelength, a photo-acid-generating (PAG) component having substantial transparency at the wavelength, and a base-generating component having substantial absorptivity at the wavelength.

公开(公告)号：US11315798B2

公开(公告)日：2022-04-26

申请号：US16075555

申请日：2016-04-08

申请人： Intel Corporation

发明人： Robert L. Bristol ,  Marie Krysak ,  James M. Blackwell ,  Florian Gstrein ,  Kent N. Frasure

IPC分类号： G03F7/039 ,  H01L21/311 ,  G03F7/004 ,  G03F7/20 ,  G03F7/38 ,  H01L21/027 ,  H01L21/033 ,  H01L21/768

摘要： Two-stage bake photoresists with releasable quenchers for fabricating back end of line (BEOL) interconnects are described. In an example, a photolyzable composition includes an acid-deprotectable photoresist material having substantial transparency at a wavelength, a photo-acid-generating (PAG) component having substantial transparency at the wavelength, and a base-generating component having substantial absorptivity at the wavelength.