Methods for chemical mechanical polishing and forming interconnect structure

Invention Grant

US12002684B2 Methods for chemical mechanical polishing and forming interconnect structure 有权

Please log in to see more content

Patent Title: Methods for chemical mechanical polishing and forming interconnect structure
Application No.: US18057728

Application Date: 2022-11-21
Publication No.: US12002684B2

Publication Date: 2024-06-04
Inventor: Ji Cui , Fu-Ming Huang , Ting-Kui Chang , Tang-Kuei Chang , Chun-Chieh Lin , Wei-Wei Liang , Liang-Guang Chen , Kei-Wei Chen , Hung Yen , Ting-Hsun Chang , Chi-Hsiang Shen , Li-Chieh Wu , Chi-Jen Liu
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Applicant Address: TW Hsinchu
Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Current Assignee Address: TW Hsinchu
Agency: WPAT LAW
Agent Anthony King
Main IPC: H01L21/321
IPC: H01L21/321 ; B24B37/04 ; B24B37/10 ; C09G1/02

Methods for chemical mechanical polishing and forming interconnect structure

Abstract:

A method for CMP includes following operations. A metal stack is received. The metal layer stack includes at least a first metal layer and a second metal layer, and a top surface of the first metal layer and a top surface of the second metal layer are exposed. A protecting layer is formed over the second metal layer. A portion of the first metal layer is etched. The protecting layer protects the second metal layer during the etching of the portion of the first metal layer. A top surface of the etched first metal layer is lower than a top surface of the protecting layer. The protecting layer is removed from the second metal layer.

Public/Granted literature

US20230082084A1 METHODS FOR CHEMICAL MECHANICAL POLISHING AND FORMING INTERCONNECT STRUCTURE Public/Granted day:2023-03-16

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/18	...器件有由周期表Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体，如掺杂材料
H01L21/30	....用H01L21/20至H01L21/26各组不包含的方法或设备处理半导体材料的（在半导体材料上制作电极的入H01L21/28）
H01L21/31	.....在半导体材料上形成绝缘层的，例如用于掩膜的或应用光刻技术的（密封层入H01L21/56）；以及这些层的后处理；这些层的材料的选择
H01L21/3205	......非绝缘层的沉积，例如绝缘层上的导电层或电阻层；这些层的后处理（电极的制造入H01L21/28）
H01L21/321	.......后处理