- 专利标题: LIGHT-EMITTING DIODE PACKAGE WITH LIGHT-ALTERING MATERIAL
-
申请号: US16686457申请日: 2019-11-18
-
公开(公告)号: US20200105984A1公开(公告)日: 2020-04-02
- 发明人: Kyle Damborsky , Derek Miller , Jack Vu , Peter Scott Andrews , Jasper Cabalu , Colin Blakely , Jesse Reiherzer
- 申请人: Cree, Inc.
- 主分类号: H01L33/52
- IPC分类号: H01L33/52 ; H01L33/26 ; H01L33/60 ; H01L33/50
摘要:
Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.
公开/授权文献
- US10811573B2 Light-emitting diode package with light-altering material 公开/授权日:2020-10-20
信息查询
IPC分类: