Invention Application
- Patent Title: LIGHT-EMITTING DIODE PACKAGE WITH LIGHT-ALTERING MATERIAL
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Application No.: US16686457Application Date: 2019-11-18
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Publication No.: US20200105984A1Publication Date: 2020-04-02
- Inventor: Kyle Damborsky , Derek Miller , Jack Vu , Peter Scott Andrews , Jasper Cabalu , Colin Blakely , Jesse Reiherzer
- Applicant: Cree, Inc.
- Main IPC: H01L33/52
- IPC: H01L33/52 ; H01L33/26 ; H01L33/60 ; H01L33/50

Abstract:
Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.
Public/Granted literature
- US10811573B2 Light-emitting diode package with light-altering material Public/Granted day:2020-10-20
Information query
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