- 专利标题： Composition and Method for Fabrication of Nickel Interconnects
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申请号： US17416703申请日： 2020-01-31
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公开(公告)号： US20220064811A1公开(公告)日： 2022-03-03
- 发明人: Eric Yakobson , Shaopeng Sun , Elie Najjar , Thomas Richardson , Vincent Paneccasio, Jr. , Wenbo Shao , Kyle Whitten
- 申请人： MacDermid Enthone Inc.
- 申请人地址： US CT Waterbury
- 专利权人： MacDermid Enthone Inc.
- 当前专利权人： MacDermid Enthone Inc.
- 当前专利权人地址： US CT Waterbury
- 国际申请： PCT/US20/16020 WO 20200131
- 主分类号： C25D3/18
- IPC分类号： C25D3/18 ; H01L21/768 ; H01L21/288 ; C25D7/12 ; C25D5/02 ; C25D21/10
摘要：
A nickel electrodeposition composition for via fill or barrier nickel interconnect fabrication comprising: (a) a source of nickel ions; (b) one or more polarizing additives; and (c) one or more depolarizing additives. The nickel electrodeposition composition may include various additives, including suitable acids, surfactants, buffers, and/or stress modifiers to produce bottom-up filling of vias and trenches.