Invention Application
- Patent Title: OFF-PACKAGE HIGH DENSITY, HIGH BANDWIDTH MEMORY ACCESS USING OPTICAL LINKS
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Application No.: US17031823Application Date: 2020-09-24
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Publication No.: US20220092016A1Publication Date: 2022-03-24
- Inventor: Mahesh K. KUMASHIKAR , Dheeraj SUBBAREDDY , Anshuman THAKUR , MD Altaf HOSSAIN , Ankireddy NALAMALPU , Casey G. THIELEN , Daniel S. KLOWDEN , Kevin P. MA , Sergey Yuryevich SHUMARAYEV , Sandeep SANE , Conor O'KEEFFE
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: G06F13/42
- IPC: G06F13/42 ; G06F13/40 ; G06F13/16 ; G11C7/10

Abstract:
Embodiments herein relate to systems, apparatuses, or techniques for using an optical physical layer die within a system-on-a-chip to optically couple with an optical physical layer die on another package to provide high-bandwidth memory access between the system-on-a-chip and the other package. In embodiments, the other package may be a large optically connected memory device that includes a memory controller coupled with an optical physical layer die, where the memory controller is coupled with memory. Other embodiments may be described and/or claimed.
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