公开(公告)号：US20220092016A1

公开(公告)日：2022-03-24

申请号：US17031823

申请日：2020-09-24

Applicant: Intel Corporation

Inventor： Mahesh K. KUMASHIKAR ,  Dheeraj SUBBAREDDY ,  Anshuman THAKUR ,  MD Altaf HOSSAIN ,  Ankireddy NALAMALPU ,  Casey G. THIELEN ,  Daniel S. KLOWDEN ,  Kevin P. MA ,  Sergey Yuryevich SHUMARAYEV ,  Sandeep SANE ,  Conor O'KEEFFE

IPC: G06F13/42 ,  G06F13/40 ,  G06F13/16 ,  G11C7/10

Abstract: Embodiments herein relate to systems, apparatuses, or techniques for using an optical physical layer die within a system-on-a-chip to optically couple with an optical physical layer die on another package to provide high-bandwidth memory access between the system-on-a-chip and the other package. In embodiments, the other package may be a large optically connected memory device that includes a memory controller coupled with an optical physical layer die, where the memory controller is coupled with memory. Other embodiments may be described and/or claimed.