公开(公告)号：US20230101340A1

公开(公告)日：2023-03-30

申请号：US17485295

申请日：2021-09-24

申请人： Intel Corporation

发明人： Kaveh HOSSEINI ,  Omkar KARHADE ,  Ravindranath V. MAHAJAN ,  Sergey Yuryevich SHUMARAYEV ,  Yew F. KOK ,  Sai VADLAMANI

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L21/48 ,  H01L25/00

摘要： Embodiments disclosed herein include electronic packages and methods of assembling an electronic package. In an embodiment, an electronic package comprises a package substrate with a stepped top surface, and a first die on a first plateau of the stepped top surface. In an embodiment, a second die is on a second plateau of the stepped top surface, where the second die extends over the first die, In an embodiment, a third die is on a third plateau of the stepped top surface, where the third die extends over the second die.

公开(公告)号：US20220092016A1

公开(公告)日：2022-03-24

申请号：US17031823

申请日：2020-09-24

申请人： Intel Corporation

发明人： Mahesh K. KUMASHIKAR ,  Dheeraj SUBBAREDDY ,  Anshuman THAKUR ,  MD Altaf HOSSAIN ,  Ankireddy NALAMALPU ,  Casey G. THIELEN ,  Daniel S. KLOWDEN ,  Kevin P. MA ,  Sergey Yuryevich SHUMARAYEV ,  Sandeep SANE ,  Conor O'KEEFFE

IPC分类号： G06F13/42 ,  G06F13/40 ,  G06F13/16 ,  G11C7/10

摘要： Embodiments herein relate to systems, apparatuses, or techniques for using an optical physical layer die within a system-on-a-chip to optically couple with an optical physical layer die on another package to provide high-bandwidth memory access between the system-on-a-chip and the other package. In embodiments, the other package may be a large optically connected memory device that includes a memory controller coupled with an optical physical layer die, where the memory controller is coupled with memory. Other embodiments may be described and/or claimed.