公开(公告)号：US20220196936A1

公开(公告)日：2022-06-23

申请号：US17132967

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Kaveh HOSSEINI ,  Xiaoqian LI ,  Conor O'KEEFFE ,  Jing FANG ,  Kevin P. MA ,  Shamsul ABEDIN

IPC: G02B6/42 ,  H01L21/66

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to a bidirectional optical grating coupler that may be used for testing. A photonic apparatus includes a first layer with electro-optical circuitry that is optically coupled with a bidirectional optical grating coupler. A second layer is physically coupled with a first side of the first layer and includes a first light path to optically coupled with the bidirectional optical grating coupler. A third layer is physically coupled with a second side of the first layer opposite the first side of the first layer, and includes a second light path that optically couples with the bidirectional grating coupler. Operational testing of the electro-optical circuitry is based in part on light received or transmitted through the second light path. Other embodiments may be described and/or claimed.

公开(公告)号：US20220107465A1

公开(公告)日：2022-04-07

申请号：US17553053

申请日：2021-12-16

Applicant: Intel Corporation

Inventor： Ralph JENSEN ,  Michael T. CROCKER ,  Aaron GORIUS ,  Kevin P. MA

IPC: G02B6/38 ,  H04L49/25 ,  H04J14/02

Abstract: Apparatus and methods employing wormhole structures supporting ultra-high density optical routing systems. Microstructures comprising wormhole tunnels are formed in optical looms with wormhole openings arranged in patterns, such as a high-density XY grid. Optical fibers are inserted into respective wormhole tunnels, and sleeves are used to precisely align fiber ends. A rack loom comprising a wormhole backplane is fabricated in a similar manner, with wormhole openings arrayed in the same patterns. The sleeves comprise plug-receptacle sleeve pairs, where when an optical loom (or connector bar of the optical loom) face urged toward the front face of the rack loom, the plug and receptacle sleeves are mated, resulting in precise alignment of the optical fiber ends in the pairs of sleeves. Palpebral structures may also be fabricated to provide a self-cleaning function with optional lubrication. The solutions provide more than an order of magnitude improvement over current fiber connector densities, while substantially reducing costs.

公开(公告)号：US20220092016A1

公开(公告)日：2022-03-24

申请号：US17031823

申请日：2020-09-24

Applicant: Intel Corporation

Inventor： Mahesh K. KUMASHIKAR ,  Dheeraj SUBBAREDDY ,  Anshuman THAKUR ,  MD Altaf HOSSAIN ,  Ankireddy NALAMALPU ,  Casey G. THIELEN ,  Daniel S. KLOWDEN ,  Kevin P. MA ,  Sergey Yuryevich SHUMARAYEV ,  Sandeep SANE ,  Conor O'KEEFFE

IPC: G06F13/42 ,  G06F13/40 ,  G06F13/16 ,  G11C7/10

Abstract: Embodiments herein relate to systems, apparatuses, or techniques for using an optical physical layer die within a system-on-a-chip to optically couple with an optical physical layer die on another package to provide high-bandwidth memory access between the system-on-a-chip and the other package. In embodiments, the other package may be a large optically connected memory device that includes a memory controller coupled with an optical physical layer die, where the memory controller is coupled with memory. Other embodiments may be described and/or claimed.