- 专利标题： ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES
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申请号： US18091028申请日： 2022-12-29
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公开(公告)号： US20240217216A1公开(公告)日： 2024-07-04
- 发明人: Kristof DARMAWIKARTA , Tarek A. IBRAHIM , Srinivas V. PIETAMBARAM , Dilan SENEVIRATNE , Jieying KONG , Thomas HEATON , Whitney BRYKS , Vinith BEJUGAM , Junxin WANG , Gang DUAN
- 申请人： INTEL CORPORATION
- 申请人地址： US CA SANTA CLARA
- 专利权人： INTEL CORPORATION
- 当前专利权人： INTEL CORPORATION
- 当前专利权人地址： US CA SANTA CLARA
- 主分类号： B32B17/10
- IPC分类号： B32B17/10 ; B32B7/12 ; B32B17/02 ; B65D85/48
摘要：
Embodiments disclosed herein include package substrates with glass stiffeners. In an embodiment, the package substrate comprises a first layer, where the first layer comprises glass. In an embodiment, the package substrate comprises a second layer over the first layer, where the second layer is a buildup film. In an embodiment, the package substrate further comprises an electrically conductive interconnect structure through the first layer and the second layer.
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