Invention Application
- Patent Title: Metal Contacts on Metal Gates and Methods Thereof
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Application No.: US18781018Application Date: 2024-07-23
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Publication No.: US20240379378A1Publication Date: 2024-11-14
- Inventor: Pang-Sheng Chang , Yu-Feng Yin , Chao-Hsun Wang , Kuo-Yi Chao , Fu-Kai Yang , Mei-Yun Wang , Feng-Yu Chang , Chen-Yuan Kao , Chia-Yang Hung , Chia-Sheng Chang , Shu-Huei Suen , Jyu-Horng Shieh , Sheng-Liang Pan , Jack Kuo-Ping Kuo , Shao-Jyun Wu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Main IPC: H01L21/321
- IPC: H01L21/321 ; H01L21/28 ; H01L29/49 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor structure includes a metal gate structure including a gate dielectric layer and a gate electrode, a conductive layer disposed on the gate electrode, and a gate contact disposed on the conductive layer. The conductive layer extends from a position below a top surface of the metal gate structure to a position above the top surface of the metal gate structure. The gate electrode includes at least a first metal, and the conductive layer includes at least the first metal and a second metal different from the first metal. Laterally the conductive layer is fully between opposing sidewalls of the metal gate structure.
Information query
IPC分类: