发明授权
- 专利标题: Semiconductor encapsulating epoxy resin composition and semiconductor device
- 专利标题(中): 半导体封装环氧树脂组合物和半导体器件
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申请号: US09558384申请日: 2000-04-26
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公开(公告)号: US06630745B1公开(公告)日: 2003-10-07
- 发明人: Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
- 申请人: Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
- 优先权: JP11-118155 19990426; JP11-118408 19990426
- 主分类号: H01L2329
- IPC分类号: H01L2329
摘要:
A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.