Epoxy resin composition
    9.
    发明授权
    Epoxy resin composition 失效
    环氧树脂组合物

    公开(公告)号:US6001901A

    公开(公告)日:1999-12-14

    申请号:US993867

    申请日:1997-12-18

    IPC分类号: C08K3/36 C08L63/00 C08L63/02

    CPC分类号: C08L63/00 C08K3/36

    摘要: An epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler has a melt viscosity of at most 150 poise at 175.degree. C. The inorganic filler has a BET specific surface area of 1.5-6 m.sup.2 /g and is such that when a 75/25 mixture of the inorganic filler and a bisphenol F type liquid epoxy resin is measured for viscosity at shear rates of 0.6/sec. and 10/sec. at a temperature of 25.+-.0.05.degree. C. by an E type viscometer, the ratio of the viscosity at 0.6/sec. to the viscosity at 10/sec. is at least 3.5/1. The amount of the inorganic filler loaded is 80-90% by weight of the composition. The composition is suitable for the encapsulation of matrix frames.

    摘要翻译: 包含环氧树脂,固化剂和无机填料的环氧树脂组合物在175℃下的熔融粘度至多为150泊。无机填料的BET比表面积为1.5-6m 2 / g,为 当以0.6 /秒的剪切速率测量无机填料和双酚F型液体环氧树脂的75/25混合物的粘度时。 和10 /秒。 通过E型粘度计在25 +/- 0.05℃的温度下,粘度在0.6 /秒的比例。 以10 /秒的粘度。 至少为3.5 / 1。 无机填料的加入量为组合物重量的80-90%。 该组合物适用于矩阵框架的封装。