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1.发明授权公开(公告)号：US06291556B1
公开(公告)日：2001-09-18
申请号：US09534386
申请日：2000-03-24
申请人： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
发明人： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
IPC分类号： C08K6300
CPC分类号： H01L23/293 , C08K3/2279 , C08K9/08 , C08K2003/026 , C08K2201/019 , C08L63/00 , H01L2924/0002 , C08L2666/22 , C08L61/04 , H01L2924/00
摘要： A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a microencapsulated flame retardant comprising a red phosphorus-base core coated with a thermoplastic resin and/or thermosetting resin, (D) a molybdenum compound, and (E) an inorganic filler. The composition and its cured product have moisture-proof reliability and high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
摘要翻译： 提供半导体封装环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）包含涂覆有热塑性树脂和/或热固性树脂的红磷基芯的微胶囊阻燃剂， （D）钼化合物和（E）无机填料。 即使没有卤化环氧树脂和氧化锑，该组合物及其固化产品具有防湿可靠性和高阻燃性。
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2.发明授权公开(公告)号：US06630745B1
公开(公告)日：2003-10-07
申请号：US09558384
申请日：2000-04-26
申请人： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
发明人： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
IPC分类号： H01L2329
CPC分类号： H01L23/293 , C08L63/00 , H01L2924/0002 , Y10T428/12528 , Y10T428/31511 , C08L83/00 , H01L2924/00
摘要： A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
摘要翻译： 提供半导体封装环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）钼化合物，（Di）有机聚硅氧烷，（D-ii）有机聚硅氧烷固化产物或（ D-iii）通过环氧树脂或含烯基的环氧树脂与有机氢聚硅氧烷反应得到的嵌段共聚物和（E）无机填料。 尽管没有卤化环氧树脂和氧化锑，该组合物具有改进的成型性和耐焊料裂纹性，同时显示出高阻燃性。
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公开(公告)号：US07095125B2
公开(公告)日：2006-08-22
申请号：US10617827
申请日：2003-07-14
申请人： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
发明人： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
IPC分类号： H01L23/29
CPC分类号： H01L23/293 , C08L63/00 , H01L2924/0002 , Y10T428/12528 , Y10T428/31511 , C08L83/00 , H01L2924/00
摘要： A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
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4.发明授权公开(公告)号：US06894091B2
公开(公告)日：2005-05-17
申请号：US09883276
申请日：2001-06-19
申请人： Shoichi Osada , Toshio Shiobara , Eiichi Asano , Kazutoshi Tomiyoshi , Takayuki Aoki , Shigeki Ino
发明人： Shoichi Osada , Toshio Shiobara , Eiichi Asano , Kazutoshi Tomiyoshi , Takayuki Aoki , Shigeki Ino
CPC分类号： H01L23/293 , C08L63/00 , H01L2924/0002 , C08L61/04 , H01L2924/00
摘要： A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, and (D) 300-900 parts by weight per 100 parts by weight of components (A) and (B) combined of an inorganic filler contains nitrogen atoms in an amount of 1.5-20% by weight based on the weight of components (A) and (B) combined. Cured parts of the composition exhibit high-temperature capabilities and flame retardance despite the absence of halogenated epoxy resins and antimony trioxide.
摘要翻译： 一种半导体封装环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）钼化合物和（D）每100重量份组分（A）300-900重量份， 和（B）组合的无机填料含有以组分（A）和（B）的重量计为1.5-20重量％的氮原子。 尽管没有卤化环氧树脂和三氧化锑，组合物的固化部分表现出高温能力和阻燃性。
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5.发明授权公开(公告)号：US06297306B1
公开(公告)日：2001-10-02
申请号：US09310924
申请日：1999-05-13
IPC分类号： C08K310
CPC分类号： C08K3/22 , C08K3/2279 , C08K2003/2227 , C08L63/00
摘要： An epoxy resin composition comprising (A) a biphenyl skeleton epoxy resin, (B) a biphenyl skeleton phenolic resin as a curing agent, (C) molybdenum compound, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.
摘要翻译： 一种环氧树脂组合物，其包含（A）联苯骨架环氧树脂，（B）作为固化剂的联苯骨架酚醛树脂，（C）钼化合物和（D）无机填料适合于半导体封装，因为它是有效模塑的 并固化成具有改善的回流裂纹性，耐湿性和阻燃性的部分。 它不会对人体健康或环境构成危害。
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6.发明授权公开(公告)号：US06177489B1
公开(公告)日：2001-01-23
申请号：US09003517
申请日：1998-01-06
申请人： Satoshi Okuse , Kazutoshi Tomiyoshi , Toshio Shiobara , Takayuki Aoki , Eiichi Asano , Shigeki Ino
发明人： Satoshi Okuse , Kazutoshi Tomiyoshi , Toshio Shiobara , Takayuki Aoki , Eiichi Asano , Shigeki Ino
IPC分类号： C08L6302
CPC分类号： H01L23/295 , C08G59/245 , C08G59/621 , C08K3/36 , C08K5/20 , C08K5/5397 , C08K5/54 , C08L63/00 , C09K21/14 , H01L2924/0002 , C08L83/00 , C08L2666/22 , H01L2924/00
摘要： A flame retardant epoxy resin composition suitable for semiconductor encapsulation contains (A) a crystalline epoxy resin whose 30 wt % m-cresol solution has a viscosity of lower than 80 centipoise at 25° C., (B) a curing agent having at least two phenolic hydroxyl groups, and (C) silica. The composition optionally contains (D) an organopolysiloxane, (E) an organic phosphine oxide, (F) an amide group-containing release agent, and/or (G) a silane coupling agent. The cured composition achieves flame retardance rating UL-94 V-0 without a need for flame retardants and remains stable at high temperature.
摘要翻译： 适用于半导体封装的阻燃性环氧树脂组合物含有（A）30重量％间甲酚溶液在25℃时粘度低于80厘泊的结晶环氧树脂，（B）具有至少两个 酚羟基和（C）二氧化硅。 组合物任选地含有（D）有机聚硅氧烷，（E）有机氧化膦，（F）含酰胺基的脱模剂和/或（G）硅烷偶联剂。 固化的组合物获得UL-94V-0的阻燃等级，而不需要阻燃剂并在高温下保持稳定。
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7.发明授权Encapsulant of crystalline epoxy resin and phenolic resin-crystalline epoxy resin reaction product 失效结晶环氧树脂和酚醛树脂结晶环氧树脂反应产品的封装剂
公开(公告)号：US6027812A
公开(公告)日：2000-02-22
申请号：US6868
申请日：1998-01-14
申请人： Toshio Shiobara , Takayuki Aoki , Shigeki Ino , Eiichi Asano , Satoshi Okuse , Kazutoshi Tomiyoshi
发明人： Toshio Shiobara , Takayuki Aoki , Shigeki Ino , Eiichi Asano , Satoshi Okuse , Kazutoshi Tomiyoshi
CPC分类号： H01L23/293 , C08L63/00 , H01L2924/0002 , Y10T428/31511
摘要： An epoxy resin composition comprising a crystalline epoxy resin, a phenolic resin, and an inorganic filler is improved in moldability by previously reacting phenolic hydroxyl groups on the phenolic resin with epoxy groups on the crystalline epoxy resin to form a reaction product and blending the reaction product in the composition. The composition is moldable over semiconductor devices without voids and wire flow. The encapsulated semiconductor devices thus remain reliable.
摘要翻译： 包含结晶环氧树脂，酚醛树脂和无机填料的环氧树脂组合物通过预先使酚醛树脂上的酚羟基与环氧基上的环氧基团反应形成反应产物，将反应产物 在组合中。 该组合物可在无空隙和电线流动的半导体器件上成型。 因此，封装的半导体器件保持可靠。
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8.发明授权
公开(公告)号：US6162878A
公开(公告)日：2000-12-19
申请号：US310999
申请日：1999-05-13
IPC分类号： C08G59/08 , C08G59/20 , C08G59/40 , C08G59/62 , C08K3/00 , C08L61/04 , C08L63/00 , C08L83/04 , H01L23/29 , H01L23/31
CPC分类号： H01L23/293 , C08G59/08 , C08G59/4085 , C08L61/04 , C08L63/00 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： An epoxy resin composition comprising (A) a biphenyl skeleton-bearing epoxy resin, (B) a biphenyl skeleton-bearing phenolic resin as a curing agent, (C) an organosiloxane containing phenyl and organooxy groups, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.
摘要翻译： 一种环氧树脂组合物，其包含（A）含有联苯骨架的环氧树脂，（B）含有联苯骨架的酚醛树脂作为固化剂，（C）含有苯基和有机氧基的有机硅氧烷和（D）无机填料， 适用于半导体封装，因为它可以有效地模制，并固化成具有改善的回流裂纹性，耐湿性和阻燃性的部分。 它不会对人体健康或环境构成危害。
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9.发明授权
公开(公告)号：US6160078A
公开(公告)日：2000-12-12
申请号：US189408
申请日：1998-11-10
CPC分类号： H01L23/293 , C08G59/3218 , C08L63/00 , H01L2924/0002 , C08L2666/22 , H01L2924/00
摘要： An epoxy resin composition comprising an epoxy resin of a specific structure, a phenolic resin of a specific structure, and an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into products having improved flame retardance, reflow crack resistance and dielectric properties.
摘要翻译： 包含特定结构的环氧树脂，特定结构的酚醛树脂和无机填料的环氧树脂组合物适用于半导体封装，因为它可有效地模塑并固化成具有改进的阻燃性，回流裂纹性和介电性能的产品 。
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10.发明授权公开(公告)号：US06723452B2
公开(公告)日：2004-04-20
申请号：US10196222
申请日：2002-07-17
申请人： Yasuo Kimura , Kazutoshi Tomiyoshi , Tarou Shimoda , Eiichi Asano , Takayuki Aoki , Toshio Shiobara
发明人： Yasuo Kimura , Kazutoshi Tomiyoshi , Tarou Shimoda , Eiichi Asano , Takayuki Aoki , Toshio Shiobara
IPC分类号： H01L2912
CPC分类号： H01L23/293 , C08G59/20 , C08G59/245 , C08G59/3218 , C08L63/00 , H01L2924/0002 , Y10T428/12528 , C08L2666/22 , H01L2924/00
摘要： Epoxy resin compositions comprising (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a structure in which two benzene rings can be directly conjugated, carbon atoms having an sp2 type atomic orbital accounting for at least 50% of all the carbon atoms, (B) a &bgr;-naphthol type phenolic resin curing agent, (C) a curing accelerator, and (D) an inorganic filler cure into products having satisfactory solder crack resistance on use of lead-free solder and improved flame retardance despite the absence of halogenated epoxy resins and antimony compounds and are thus suited for semiconductor encapsulation.
摘要翻译： 环氧树脂组合物，其包含（A）环氧当量至少为185的具有两个苯环可以直接键合的结构的环氧树脂，具有sp 2类型原子轨道的碳原子占至少50％ 所有碳原子，（B）β-萘酚型酚醛树脂固化剂，（C）固化促进剂，和（D）无机填料固化成使用无铅焊料和改善火焰时具有令人满意的耐焊料裂纹性的产品 尽管不存在卤化环氧树脂和锑化合物，因此适用于半导体封装。
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