发明授权
- 专利标题： Semiconductor device
- 专利标题（中）： 半导体器件
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申请号： US13526821申请日： 2012-06-19
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公开(公告)号： US08736053B2公开(公告)日： 2014-05-27
- 发明人: Koichi Tanaka , Nobuyuki Kurashima , Hajime Iizuka , Tetsuya Koyama
- 申请人： Koichi Tanaka , Nobuyuki Kurashima , Hajime Iizuka , Tetsuya Koyama
- 申请人地址： JP Nagano-shi, Nagano
- 专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人地址： JP Nagano-shi, Nagano
- 代理机构： Drinker Biddle & Reath LLP
- 优先权： JP2011-136474 20110620
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A circuit substrate having a mounting surface on which a semiconductor chip is mounted and at least one connection pad formed on the mounting surface is connected to a support plate having at least one mounting portion with a diameter larger than a diameter of the connection pad, through a truncated-cone-shaped solder layer which is formed from at least one solder ball on the basis of a difference between the diameter of the mounting portion and the diameter of the connection pad.
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