Invention Grant
- Patent Title: Additives for grain fragmentation in Pb-free Sn-based solder
- Patent Title (中): 在无铅锡基焊料中颗粒破碎的添加剂
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Application No.: US13932070Application Date: 2013-07-01
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Publication No.: US08910853B2Publication Date: 2014-12-16
- Inventor: Charles L. Arvin , Alexandre Blander , Peter J. Brofman , Donald W. Henderson , Gareth G. Hougham , Hsichang Liu , Eric D. Perfecto , Srinivasa S.N. Reddy , Krystyna W. Semkow , Kamalesh K. Srivastava , Brian R. Sundlof , Julien Sylvestre , Renee L. Weisman
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Steven J. Meyers
- Main IPC: B23K31/02
- IPC: B23K31/02 ; H01L21/44 ; B23K35/36 ; C22C13/00 ; B23K35/02 ; B23K35/26 ; H01L23/498 ; H01B13/00 ; H01B1/02 ; H05K3/34 ; B82Y30/00
Abstract:
In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.
Public/Granted literature
- US20130284495A1 ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER Public/Granted day:2013-10-31
Information query
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