发明授权
- 专利标题： Electrolytic copper process using anion permeable barrier
- 专利标题（中）： 电解铜工艺采用阴离子渗透屏障
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申请号： US14507692申请日： 2014-10-06
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公开(公告)号： US09234293B2公开(公告)日： 2016-01-12
- 发明人: Rajesh Baskaran , Robert W. Batz, Jr. , Bioh Kim , Thomas L. Ritzdorf , John Lee Klocke , Kyle M. Hanson
- 申请人： APPLIED Materials, Inc.
- 申请人地址： US CA Santa Clara
- 专利权人： APPLIED Materials, Inc.
- 当前专利权人： APPLIED Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Christensen O'Connor Johnson Kindness PLLC
- 主分类号： C25D17/00
- IPC分类号： C25D17/00 ; C25D7/12 ; C25D5/02 ; C25D3/38 ; C25F3/02 ; H01L21/288 ; H01L21/768 ; C25D3/12 ; C25D3/20 ; C25D3/30 ; C25D3/34 ; C25D3/46 ; C25D3/54 ; C25D21/12 ; H05K3/42
摘要：
Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and a counter electrode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, a counter electrode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids.
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