Invention Grant
- Patent Title: Test apparatus for semiconductor package
- Patent Title (中): 半导体封装测试装置
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Application No.: US13961201Application Date: 2013-08-07
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Publication No.: US09255959B2Publication Date: 2016-02-09
- Inventor: Chan-Sik Kwon , Seok-Won Jeong , Jae-Ho Choi , Jun-Young Ko
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2012-0098819 20120906
- Main IPC: G01N23/04
- IPC: G01N23/04 ; G01R31/26 ; G01R31/28 ; G01R31/308
Abstract:
A test apparatus for a semiconductor package comprising an X-ray analyzer acquiring an X-ray image of the semiconductor package and detecting a thickness of the semiconductor package from the X-ray image, and a thermal reaction analyzer applying a voltage to the semiconductor package and detecting a failure position of the semiconductor package using a surface temperature of the semiconductor package and the thickness of the semiconductor package may be provided.
Public/Granted literature
- US20140062496A1 TEST APPARATUS FOR SEMICONDUCTOR PACKAGE Public/Granted day:2014-03-06
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