公开(公告)号：US09255959B2

公开(公告)日：2016-02-09

申请号：US13961201

申请日：2013-08-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chan-Sik Kwon ,  Seok-Won Jeong ,  Jae-Ho Choi ,  Jun-Young Ko

IPC: G01N23/04 ,  G01R31/26 ,  G01R31/28 ,  G01R31/308

CPC classification number: G01R31/2607 ,  G01N23/04 ,  G01R31/2896 ,  G01R31/308

Abstract: A test apparatus for a semiconductor package comprising an X-ray analyzer acquiring an X-ray image of the semiconductor package and detecting a thickness of the semiconductor package from the X-ray image, and a thermal reaction analyzer applying a voltage to the semiconductor package and detecting a failure position of the semiconductor package using a surface temperature of the semiconductor package and the thickness of the semiconductor package may be provided.

Abstract translation: 一种半导体封装的测试装置，包括：X射线分析仪，获取半导体封装的X射线图像，并从X射线图像检测半导体封装的厚度，以及向半导体封装施加电压的热反应分析器 并且可以提供使用半导体封装的表面温度和半导体封装的厚度来检测半导体封装的故障位置。