公开(公告)号：US09484323B2

公开(公告)日：2016-11-01

申请号：US14718438

申请日：2015-05-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seok-Won Jeong

IPC: H01L21/00 ,  H01L23/00 ,  H01L21/66 ,  H01L25/00 ,  H01L25/065 ,  B23K20/00

CPC classification number: H01L24/85 ,  B23K20/007 ,  B23K2101/40 ,  H01L22/14 ,  H01L22/22 ,  H01L24/48 ,  H01L24/78 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/789 ,  H01L2224/85181 ,  H01L2224/859 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: In a method of manufacturing a semiconductor package, a first semiconductor chip is adhered to a package substrate. An end portion of a wire is bonded to a first bonding pad of the first semiconductor chip by using a capillary. An operating voltage of the first semiconductor chip is applied to the first bonding pad through the wire to detect a leakage current. A second end portion of the wire is bonded to the first connection pad by using the capillary, according to a result of the detection.

Abstract translation: 在制造半导体封装的方法中，第一半导体芯片粘附到封装衬底。 线的端部通过使用毛细管结合到第一半导体芯片的第一焊盘。 通过导线将第一半导体芯片的工作电压施加到第一焊盘，以检测漏​​电流。 根据检测的结果，通过使用毛细管将导线的第二端部接合到第一连接焊盘。

公开(公告)号：US09255959B2

公开(公告)日：2016-02-09

申请号：US13961201

申请日：2013-08-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chan-Sik Kwon ,  Seok-Won Jeong ,  Jae-Ho Choi ,  Jun-Young Ko

IPC: G01N23/04 ,  G01R31/26 ,  G01R31/28 ,  G01R31/308

CPC classification number: G01R31/2607 ,  G01N23/04 ,  G01R31/2896 ,  G01R31/308

Abstract: A test apparatus for a semiconductor package comprising an X-ray analyzer acquiring an X-ray image of the semiconductor package and detecting a thickness of the semiconductor package from the X-ray image, and a thermal reaction analyzer applying a voltage to the semiconductor package and detecting a failure position of the semiconductor package using a surface temperature of the semiconductor package and the thickness of the semiconductor package may be provided.

Abstract translation: 一种半导体封装的测试装置，包括：X射线分析仪，获取半导体封装的X射线图像，并从X射线图像检测半导体封装的厚度，以及向半导体封装施加电压的热反应分析器 并且可以提供使用半导体封装的表面温度和半导体封装的厚度来检测半导体封装的故障位置。