Invention Grant
- Patent Title: Ball grid array and land grid array having modified footprint
- Patent Title (中): 球栅阵列和焊盘网格阵列具有修改的占位面积
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Application No.: US13686552Application Date: 2012-11-27
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Publication No.: US09560771B2Publication Date: 2017-01-31
- Inventor: Ying-Tang Su , Wei-Feng Lin , Kah-Ong Tan
- Applicant: OMNIVISION TECHNOLOGIES, INC.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/18 ; H05K13/04 ; H05K3/34 ; H04N5/225 ; H01L27/146 ; H01L23/498
Abstract:
An apparatus includes a substrate having a surface and a plurality of solder balls arranged on the surface to form a ball grid array. A portion of the plurality of solder balls is arranged to have a pitch between adjacent solder balls. The adjacent solder balls having the pitch have a shape of a truncated sphere. At least one solder ball of the plurality of solder balls is included in a solder island on the surface having a shape that is different than the shape of the truncated sphere.
Public/Granted literature
- US20140146505A1 BALL GRID ARRAY AND LAND GRID ARRAY HAVING MODIFIED FOOTPRINT Public/Granted day:2014-05-29
Information query
